Thermal Systems Engineer - 3D Semiconductor Packaging
Listed on 2026-11-01
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Engineering
Systems Engineer, Packaging Engineer, Electrical Engineering, Mechanical Engineer
Acceler8 Talent is seeking a Thermal & Thermo-Mechanical Engineer for an early-stage semiconductor company developing a multi-material 3D integration platform. You design, simulate and validate thermal and mechanical performance in dense packages to enable higher density and reliability.
You will translate models into design choices, work with packaging, electrical and reliability engineers, and drive hardware validation from concept to working hardware in a small, fast-moving team.
As a Thermal Systems Engineer - 3D Semiconductor Packaging, you will play an important part at Acceler8 Talent in MA, United States.
This is a genuine role to take on the Thermal Systems Engineer - 3D Semiconductor Packaging role at Acceler8 Talent.
We invite applications for the Thermal Systems Engineer - 3D Semiconductor Packaging position located in MA, United States.
The following opportunity is for a Thermal Systems Engineer - 3D Semiconductor Packaging with Acceler8 Talent.
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