EM- Package Design Engineer
Listed on 2026-10-18
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Engineering
Electronics Engineer, Electrical Engineering, Systems Engineer, Engineering Design & Technologists
New England Area (fully remote)
Otava Inc., based in Moorestown, New Jersey, is a fabless semiconductor company specializing in RF and millimeter-wave technologies. Our mission is to provide cutting- edge radio frequency integrated solutions for emerging defense, 5G/6G, and satellite communication applications. As a small and growing company, we concentrate on developing high-performance, wideband chips and system-on-chip (SoC) solutions.
We are seeking an enthusiastic and collaborative EM / Package Design Engineer to join our dynamic team. The ideal candidate will possess a strong technical background in RF and Microwave Electromagnetic analysis as well as some experience with package design and layout. This position requires excellent communication skills and a self-driven mindset, presenting significant opportunities for professional development and career advancement.
Key Responsibilities:- Electromagnetic analysis of 2.5D and 3D microelectronic packages
- Design and layout of multi-chip packages in Allegro Package Designer
- Organize and present clear technical results during design reviews
- MSEE or PhD in Electrical Engineering (required)
- Graduate school experience or 3+ years of industry experience in EM modeling or IC
- design with an interest in EM modeling
- Experienced with 3D electromagnetic solvers, such as HFSS
- Experienced with Cadence Virtuoso Schematic and Layout design flow.
- Strong team player mindset, driven to overcome design challenges, learn and succeed
- U.S. citizenship or Green Card holder (required)
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