Advanced Packaging Modeling Engineer

## Advanced Packaging Modeling Engineer Apply locations:
USA
- New York
- Maltatime type:
Full time posted on:
Posted Todayjob requisition :
JR-2603518

We are looking for an experienced mechanical, thermal or electrical modeler / engineer to address 3

DHI and advanced packaging questions for a wide range of logic, RF, analog and memory technologies.  This person will focus upon the use of commercial modeling tools for guiding device, integration and 3

DHI advanced packaging optimizations for mechanical, thermal or electrical performance optimizations.
** About Global Foundries:
** Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit
** Summary of Role:
** We are looking for an experienced mechanical, thermal or electrical modeler / engineer to address 3

DHI and advanced packaging questions for a wide range of logic, RF, analog and memory technologies.  This person will focus upon the use of commercial modeling tools for guiding device, integration and 3

DHI advanced packaging optimizations for mechanical, thermal or electrical performance optimizations.
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* Work Location:

** This position is for a role in our state-of-the-art 300mm fabrication facility in Malta, New York.
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* Essential Responsibilities:

*** Familiarity with commercial software for mechanical or thermal or electrical modeling.
* Stress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling.
* Anticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling.
* Facilitate discussion with originating team to identify simulations that highlight critical process interactions and drive optimal 3

DHI technology decisions.
* Apply commercial simulation software to mimic semiconductor process flows and highlight the areas of concern.
* Extensive interaction with integration, device, and design engineers to assure development of a working technology
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* Other Responsibilities:

*** Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
* Other duties as assigned by manager.
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* Required Qualifications:

*** M.S. + minimum of 5 years of relevant experience
* PhD + minimum of 3 years of relevant experience
* Semiconductor mechanical or thermal or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software for any of those 3 modeling applications
* Must have at least an overall 3.0 GPA and proven good academic standing.
* Language Fluency - English (Written & Verbal).
* Solid understanding of semiconductor processes and integration techniques
* Good computer / software skills
* Ability to clearly present results to small and large groups
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* Preferred Qualifications:

*** PhD + 5 years of relevant experience
* Thermal and electrical simulation for specific IC circuit designs (RF analog experience preferred) and with LVS and DRC verification tools (Cadence / Mentors Graphics / Keysight ADS...)
* Demonstrated work performance in an environment requiring a high level of attention to detail and timeliness.
* Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
* Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate…