Silicon Photonics Advanced Packaging Intern; Summer

## Silicon Photonics Advanced Packaging Intern (Summer 2027)
Apply:
USA
- New York
- Malta:
Full time:
Posted Today:
JR-2604269
** About Global Foundries
** Global Foundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability.

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** Internship Program Overview:
** Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you’ll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives.

** Summary of Role:
** Global Foundries (GF) is seeking a summer 2027 intern to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors. This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-package co-design with a focus on module performance, reliability, packaging design, materials selection, and advanced chiplet integration requirements.

** Essential

Responsibilities include:

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* * Support Silicon Photonics advanced packaging innovation and customer design enablement by contributing to packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT ecosystem partners.
* Participate in cross-functional design reviews and use engineering analysis to help resolve technical, manufacturability, reliability, and yield concerns for new customer products.
* Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality, and document findings and recommendations for engineering stakeholders.
* Contribute to qualification robustness and continuous improvement plans by applying consistent design processes, tracking requirements, and supporting product development from concept through production readiness.  
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* Other Responsibilities:

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* * Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.  
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* Required Qualifications:

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* * Education – Actively pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering or a related field through an accredited degree program during the internship.
* Must have at least an overall 3.0 GPA and be in good academic standing.
* Language Fluency - English (Written & Verbal).
* Travel - Up to 10%.
* Ability to work at least 40 hours per week during the internship.  
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* Preferred Qualifications:

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* * Prior related internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics.
* Demonstrated leadership experience through academic projects, student organizations, competitions, or prior employment.
* Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
* Project management skills and the ability to innovate and execute solutions in ambiguous environments.
* Strong written and verbal…