EUV Thin Film Process Engineer -Gen DRAM
Listed on 2026-10-18
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Engineering
Process Engineer, Manufacturing Engineer, Materials Engineering
Location: New York
Micron Technology in Albany, New York, is seeking a Films Process Development Engineer to develop and optimize thin film deposition for next-generation DRAM, with emphasis on EUV patterning films. You will own processes from concept to high-volume manufacturing and drive data-driven decisions.
The role requires a PhD or MS with 3+ years in semiconductors, strong DOE skills, and experience with ALD/CVD/PECVD, surface analysis, and cross-functional teamwork.
We are looking to fill the EUV Thin Film Process Engineer for Next-Gen DRAM position at Micron Memory Malaysia Sdn Bhd in City of Albany, NY, United States.
Join Micron Memory Malaysia Sdn Bhd and contribute to our ongoing work.
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This posting is for the EUV Thin Film Process Engineer for Next-Gen DRAM role at Micron Memory Malaysia Sdn Bhd, based in City of Albany, NY, United States.
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