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Device Compact Modeling Engineer; College Graduate

Job in New York, New York County, New York, 10261, USA
Listing for: GlobalFoundries inc.
Full Time position
Listed on 2026-10-18
Job specializations:
  • Engineering
    Electronics Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 58400 USD Yearly USD 58400.00 YEAR
Job Description & How to Apply Below
Position: Device Compact Modeling Engineer (2027 New College Graduate)
Location: New York

## Device Compact Modeling Engineer (2027 New College Graduate)
Apply:
USA
- New York
- Malta:
Full time:
Posted Today:
JR-2604318
** About Global Foundries
** Global Foundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity, and sustainability.

For more information, visit   
** New College Graduates Overview:
** We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills.  
** Summary of Role:
** This position is for a Device Compact Modeling Engineer who will primarily work on digital, analog, and RF compact device model development for GF CMOS technologies. The engineer will collaborate across technology development, characterization, PDK, and design enablement teams to deliver accurate, robust, and production-ready device models for internal and external customers.  
** Essential

Responsibilities include:

*** Work on SPICE model development projects covering digital, analog, and RF devices for GF CMOS technologies while meeting project timelines and maintaining high-quality standards.
* Drive best practices and standardization in data selection, model extraction, QA, validation, and circuit benchmarking across technology platforms.
* Coordinate cross-functional teams including Device Modeling, Characterization Labs, PDK, Device Engineering, Process Integration, Design Manual, and Test Chip Design/Layout teams to execute model-related projects and resolve issues.
* Stay current on industry trends and advancements in SPICE modeling methodologies and incorporate innovative techniques into model development flows.
* Communicate project progress effectively and provide technical updates to stakeholders.
* Participate in customer engagement activities and provide technical support for compact model questions, investigations, and issue resolution.  
*
* Other Responsibilities:

*** Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.  
*
* Required Qualifications:

*** Education – Graduating with a Bachelor’s degree in Electrical Engineering, Physics or related field from an accredited degree program.
* Must have at least an overall 3.0 GPA and proven good academic standing.
* Language Fluency - English (Written & Verbal)
* Fundamental knowledge of semiconductor device physics related to compact modeling of different types of devices.
* Understanding of semiconductor device noise and matching behaviors.  
*
* Preferred Qualifications:

*** Prior related internship or co-op experience.
* Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
* Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
* Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
* Strong written and verbal communication skills
* Strong planning & organizational skills
* Experience with analog or RF design flow and methodology.
* Coding skills in Python, Perl, or other computing languages.
* Experience in machine learning and artificial intelligence.
* Experience in SPICE model generation and QA flow.
* Experience in test structure layout of individual devices and arrays.  #NCGProgramUS
** Expected Salary Range**$58,400.00 - $The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at  and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with Global Foundries is conditioned upon the successful…
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