Cryogenic TSV & 3D Packaging Engineer
Listed on 2026-10-18
-
Engineering
Packaging Engineer, Manufacturing Engineer, Process Engineer, Quality Engineering
Global Foundries Fab8 in New York is seeking an R&D TSV engineer to own development and integration of cryogenic, superconducting TSV technologies for high-density vertical interconnects in quantum packaging from concept to manufacturing.
You will lead TSV process development, define architectures, optimize designs for low loss and cryogenic stability, and drive end-to-end integration across etch, deposition, dielectric, metallization, thinning, and 2.5D/3D packaging.
The Cryogenic TSV & 3D Packaging Engineer position in the Engineering field is open for applications.
We have an opening for a Cryogenic TSV & 3D Packaging Engineer in New York, NY, United States within Engineering.
This role, Cryogenic TSV & 3D Packaging Engineer at Global Foundries, could be your next career step.
Are you ready to take on the Cryogenic TSV & 3D Packaging Engineer role at Global Foundries?
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).