Hardware Intern: Soldering & Packaging Research

At IBM Research, we are the innovation engine of IBM. Exploring

what’s next in computing and shaping the technologies the world

will rely on tomorrow. From advancing AI and hybrid cloud to

pioneering practical quantum computing, we anticipate challenges

and unlock new opportunities for clients, partners, and society.

Working in Research means joining a team that accelerates

discovery at the intersection of high-performance computing, AI,

quantum, and cloud. You’ll collaborate with leading scientists,

engineers, and visionaries to push boundaries and turn ideas into

reality. With a culture built on curiosity, creativity, and

collaboration, IBM Research offers the opportunity to grow your

career while contributing to breakthroughs that transform

industries and change the world.

Your role and responsibilities

In this role you will undertake studies of advanced bonding and reflow techniques with potential applications to high performance computing. This role will include significant efforts towards understanding the effects between different package constructions and bonding reflow techniques, providing exposure to relevant packaging analysis methods.

Required education

High School Diploma/GED

Preferred education

Bachelor's Degree

Required technical and professional expertise

Candidate for this role is required to have the following expertise:

• Studies in Physics, Microelectronics/EE, or a related discipline
• Proficient in SMT soldering processes
• Collaborate within a team on the same project
• Analytical skills to assess results of solder joints after solder process.
• Openess to learn new skills and explore innovative ideas.

Candidate for this role would also benefits from the following expertise:

• Advanced studies Microelectronics/EE or physics
• Deep knowledge of SMT assembly processes in respect to soldering
• Solder joint evaluation knowledge to assess quality of the joint and
• Knowledge how to improve solder connection based of different solder alloys and pure composition solders.
• Summarize analytical results and draw comprehensive conclusions.

IBM Research is the organic growth engine of IBM and an innovation engine for our customers and partners. As part of this mission, IBM Research anticipates and examines 'What's Next in Computing' to ultimately create and integrate the technologies the world relies upon to solve big challenges and unlock new opportunities. We create and pioneer new markets for IBM, our partners and customers as exemplified in our ongoing quest to reach practical and large-scale quantum computing.

Across IBM Research, we realize the power and potential to accelerate discovery with our partners and clients by combining the power of high performance computing, AI, and Quantum, all integrated through the hybrid cloud.

In a world where technology never stands still, we understand that, dedication to our clients success, innovation that matters, and trust and personal responsibility in all our relationships, lives in what we do as IBMers as we strive to be the catalyst that makes the world work better.

Being an IBMer means you’ll be able to learn and develop yourself and your career, you’ll be encouraged to be courageous and experiment everyday, all whilst having continuous trust and support in an environment where everyone can thrive whatever their personal or professional background.

Our IBMers are growth minded, always staying curious, open to feedback and learning new information and skills to constantly transform themselves and our company. They are trusted to provide on-going feedback to help other IBMers grow, as well as collaborate with colleagues keeping in mind a team focused approach to include different perspectives…