Quantum Interposer Technologist

The Quantum Interposer Technologist will serve as the technical leader and operational driver for IBM’s silicon spin interposer technologies, shaping process architecture, directing fabrication strategy, and ensuring the successful delivery of advanced interposer technologies. This role requires deep understanding and experience with Silicon spin interposers, including hands‑on mastery of wafer fabrication, finishing, and advanced packaging, paired with high‑level leadership across facilities planning, workforce development, capital strategy, and long‑range technology road mapping.

The ideal candidate brings extensive expertise in superconductors, RF integration, and cryogenic applications, combined with the capability to guide complex technical organizations and independently deliver robust, scalable solutions.

• Act as the primary subject matter expert for superconducting silicon spin interposer technical roadmap, influencing program direction, capability expansion, and strategic cross‑functional decision making.
• Set the technical vision and lead the development, fabrication, and continual refinement of silicon spin superconducting interposer manufacturing flows, spanning wafer‑level processing, finishing steps, multilayer integration, and advanced packaging approaches.
• Architect and evolve end‑to‑end process stacks and interposer layouts to achieve high‑performance connectivity, interface stability, and cryogenic reliability.
• Direct hands‑on manufacturing and characterization efforts; drive structured experimentation, rigorous failure analysis, and comprehensive root‑cause investigations to validate materials behavior, process interactions, and system‑level performance.
• Establish and own the governing framework for silicon spin interposer fabrication, including design rules, operational controls, reliability criteria, documentation standards, and continuous improvement practices.
• Partner closely with internal design organizations to align mask strategies, connectivity requirements, RF considerations, and cryogenic constraints throughout review and tape‑out cycles.
• Provide high‑level technical leadership and oversight to external manufacturing partners, ensuring precise alignment on superconducting materials, wafer‑level processes, packaging specifications, and deep‑cryogenic performance expectations.
• Integrate cryogenic mechanical, thermal, and RF requirements into every stage of interposer architecture, manufacturing flow, and qualification methodology.
• Lead long‑range planning for the interposer manufacturing domain, including facility design requirements, organizational build‑out, capital equipment strategy, and development timelines consistent with program milestones.