Senior Mechanical-Photonic Packaging Engineer
Listed on 2026-11-04
-
Engineering
Packaging Engineer
Nokia's Advanced Packaging R&D team seeks a mechanical engineer to drive the development of high‑performance electro‑optic modules and to integrate Silicon Photonics transceivers from concept to new product introduction.
You will design, simulate, and validate packaging architectures, coordinate with vendors, and ensure manufacturability and cost targets are met in a high‑volume setting.
The following position is for a Senior Mechanical-Photonic Packaging Engineer with NOKIA.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the Senior Mechanical-Photonic Packaging Engineer role at NOKIA, based in New York, NY, United States.
We are looking to fill the Senior Mechanical-Photonic Packaging Engineer position at NOKIA in New York, NY, United States.
The Senior Mechanical-Photonic Packaging Engineer role at NOKIA is now open for applications in New York, NY, United States.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).