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Principal ASIC Engineer; Mixed-Signal

Job in New York, New York County, New York, 10261, USA
Listing for: Voyant Photonics
Full Time position
Listed on 2026-11-04
Job specializations:
  • Engineering
    Electronics Engineer, Systems Engineer, Hardware Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 170000 - 260000 USD Yearly USD 170000.00 260000.00 YEAR
Job Description & How to Apply Below
Position: Principal ASIC Engineer (Mixed-Signal)
Location: New York

About us

Voyant Photonics is bushing the boundaries of silicon photonic chips that steer and switch light at high speed. They power next generation, chip-scale FMCW LiDAR for robotics and autonomy, and optical circuit switches (OCS) for AI data centers. Based in NYC, we’re a hands-on team designing, building, and deploying frontier hardware to solve problems that matter, from how machines see to how AI scales.

About us

Voyant Photonics is bushing the boundaries of silicon photonic chips that steer and switch light at high speed. They power next generation, chip-scale FMCW LiDAR for robotics and autonomy, and optical circuit switches (OCS) for AI data centers. Based in NYC, we’re a hands-on team designing, building, and deploying frontier hardware to solve problems that matter, from how machines see to how AI scales.

About

the Role

We're hiring our first Principal Mixed Signal ASIC Engineer to establish and lead our custom IC development program. This is a ground-floor opportunity to architect the ASIC strategy, select tools and processes, build a team, and deliver working silicon that directly enables our product roadmap. You'll work at the intersection of analog design, photonics, and high-volume manufacturing - solving technically challenging problems while enjoying the autonomy and impact of being the foundational technical hire in this domain.

The role starts hands-on (>80% IC design work) with a clear path to technical leadership and team management as we scale. If you're energized by the idea of taking full ownership - from concept through production silicon - this is your chance to define how we build ASICs.

Location: NYC preferred, with remote options available. If you're open to relocating, we’re happy to support you through the process.

What You'll Do
  • Drive analog tapeouts from concept to production across different technology nodes (130 nm and below, including BCD processes)
  • Design ultra-low-noise transimpedance amplifiers (TIAs) achieving low pA/√Hz noise performance
  • Develop mixed-signal circuits including amplifiers, ADCs, DACs, and power management blocks that interface directly with photonic ICs
  • Establish the ASIC development environment: select and deploy EDA tools, define design flows, and set standards for verification and validation
  • Collaborate closely with photonics designers, systems engineers, and FPGA/digital design teams to ensure seamless co-design
  • Provide HDL and architectural input to our external digital design partner (you won't own place-and-route for advanced node digital, but you'll guide the requirements)
  • Hire and mentor a small team of analog and digital IC designers
What We're Looking For
  • 7+ years of experience in analog and mixed-signal IC design with an 80/20 analog-to-digital focus
  • Proven track record leading multiple tapeouts from concept to production silicon
  • Deep expertise in low-noise analog circuit design, particularly transimpedance amplifiers or similar precision front-end circuits
  • Knowledge of test plan development for analog ASICs at OSAT partners
  • Strong understanding of mixed-signal design: ADCs, DACs, bias circuits, and power management
  • Experience working in both mature nodes and interfacing with advanced node digital design
  • Ability to hit the ground running: we need working silicon in 9-12 months
  • Excellent communication and collaboration skills—you'll work across disciplines daily
Nice to Have
  • Experience with photonic IC co-design or interfacing analog circuits with optical components
  • Knowledge of advanced packaging techniques (chiplets, heterogeneous integration, 2.5D/3D)
  • Background in design-for-manufacturability
  • Understanding of commercial IP ecosystems, build vs buy tradeoffs, selection, and license negotiation
Life at Voyant

We build frontier hardware &…

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