Software Engineering Intern: Prototyping & DVV in Data Networks
Listed on 2026-10-17
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Software Development
Software & AI Developer Internship
TE Connectivity Corporation is seeking an Engineering Intern in the Digital Data Networks unit at Webster, NY. You will support MPDE in software prototyping, testing and documentation for advanced laser systems that create customized fiber assemblies.
You will assist in code reviews, validation testing, and develop sub-routines to support manufacturing processes while gaining exposure to the full product development lifecycle and presenting findings to teams.
Our team is growing, and we are hiring a Software Engineering Intern:
Prototyping & DVV in Data Networks in Town of Webster, NY, United States.
All applications are reviewed carefully by our team.
The position is based in Town of Webster, NY, United States.
This opportunity is part of our work in IT & Technology, Engineering.
The advertised compensation is 29.000 - 62.000.
We aim to respond to suitable candidates as soon as possible.
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