Lead Electronics Engineer

Job Description

We have an opportunity for a skilled Lead Electronics Engineer to join the Global Combat Air Programme (GCAP) team to be based in our Edinburgh. You will have responsibility for the electronics development of a key array subsystem within the Team Tempest demonstrator Mult-Function Antenna. This UK-only project is a key part of the overall GCAP programme and will be part of the flight trials programme on Leonardo's 757 trials aircraft, Excalibur.

This is a once-in-a-generation opportunity to play a fundamental role in a defence programme of critical national importance, and to shape the future of Combat Air capability in the UK.

The role is varied but focusses on the design, integration and test of the radar array subsystem and a number of inter-connected multi-layer printed circuit board assemblies. As a Lead Electronics Engineer, you will be responsible for creating high quality and robust electronics designs; for fully documenting and recording your work products; ensuring all certification processes are adhered to and documented;

keeping the design under configuration management and providing plans and reports on progress.

The role is broad in scope and covering a wide variety of activities, from design through test and integration to certification. With a diverse mix of skills already in the team, this role can be tailored to suit the right applicant. This will be a very ‘hands‑on’ role with focus on hardware prototyping, lab measurement, debugging, integration, testing and validation of the full array sub‑system.

As a result, this will be a hybrid working role, with approximately 60% of your working hours working in the Edinburgh office.

With this role, your key areas of responsibility will be:

• Hardware requirements management.
• Functional design, verification and validation of the array subsystem.
• Technical leadership of design engineers through the lifecycle.
• Ownership of the electronics work package activities within the array subsystem.
• Developing and completing plans for subsystem level integration and verification.
• Contributing towards LRI integration and verification plans.
• Production of material for design reviews.
• Chairing of design reviews within the Physical Hardware Design Process.
• Mentoring and supervision of more junior team members.

With this role, you will develop in the following areas
:

• Domain Knowledge: you will apply and develop your knowledge of complex electronics systems in a fast‑paced and dynamic development team.
• Continuous Learning: you’ll be supported in your ongoing professional development through training and mentoring, in engineering lifecycle processes, leadership, or your own personal development.
• Teamwork: you will work alongside like‑minded professional engineers in a highly collaborative environment.
• Leadership: you will be responsible for the progress and delivery from a team of engineers to define and complete the complete testing, validation and verification of the array sub‑system.
• Connections: you will be joining an expansive team of around 9,000 people at eight major sites across the UK.
• Engineering Heritage: you will join a team with a rich heritage in Engineering, with 100 years’ experience of pioneering development.

• Degree qualified in Electronics Engineering or related science or equivalent work experience.
• Expert-level proficiency in at least one aspect of electronics design, for example: analogue, mixed-signal, digital or power electronics.
• Expert level experience in industry standard toolsets and lab measurement techniques and methods for complex electronic systems.
• Experience of team leadership and work package management.
• Strong interpersonal skills, including the ability to coach less experienced members of the team.
• Good knowledge of developing electronics within a development process framework.
• Able to demonstrate experience in most areas of the design lifecycle from requirements definition through to implementation, integration test and delivery.
• Work collaboratively across functions or in a multi‑function team including Mechanical, Firmware, Software, Manufacturing and Layout Engineers

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