Process Engineer

When you join TT, you join our global community of visionaries, creators, and achievers dedicated to engineering and manufacturing electronic solutions for a safer, healthier and more sustainable world.

At TT Electronics, Bedlington, we are seeking a highly motivated and detail-oriented Process Engineer to join the Engineering team in our Chip and Wire Assembly function. This role is pivotal in a fast‑paced microelectronics manufacturing environment, supporting the development, optimisation, and control of critical microelectronics packaging processes to ensure product quality, yield and reliability meet stringent industry standards.

The successful candidate will drive continuous improvement across die attach, wire bonding, encapsulation and related assembly operations, working closely with cross‑functional teams including production, quality and equipment engineering. The Process Engineer will play a key role in introducing new products, resolving process issues and implementing robust manufacturing solutions.

• Day‑to‑day support of production, troubleshooting issues with manufacturing equipment in a timely manner.
• Developing and optimising processes for the manufacture of microelectronics products.
• Pro‑actively identifying opportunities to improve yield and manufacturing efficiency to support continuous improvement activities.
• Commissioning and qualifying new manufacturing equipment.
• Producing technical documentation such as operating instructions, inspection standards and PFMEAs.
• Supporting the transition of products from NPI to production.
• Providing training and support to engineers and production operators.
• Maintaining detailed knowledge of the production process and equipment.
• Liaising with customers and suppliers.
• Ensuring safe working practices are adopted and health and safety legislation is adhered to when implementing new products, materials, processes or equipment.

On occasion, this role may involve visits to customers or suppliers and foreign travel.

• A degree in a relevant engineering discipline or equivalent experience.
• Technical knowledge and deep understanding of metallurgy, adhesives and the underlying physics principles behind the processes.
• Hands‑on experience operating and programming pick‑and‑place and wire bonders.
• Sound knowledge of engineering principles and concepts;
  Lean, 8D, Design of Experiments.
• Excellent interpersonal and communication skills.
• Organisational, planning and programme management skills with careful attention to detail.
• Ability to work well within a team and under pressure to meet strict deadlines.
• Good competence with MS Office applications for documentation and reporting.

• Familiarity with electronics and mechanical CAD design.
• Awareness of manufacturing hybrid circuits and multi‑chip modules (chip and wire assembly).
• Knowledge of lean manufacturing tools and statistical process techniques.
• Familiarity with MIL standards and design for high‑reliability environments.

• Enhanced pension contributions.
• Employee assistance programme.
• Site incentive plan.
• Discounted online and high street shopping and lifestyle vouchers.
• Cycle to Work Scheme.
• Discounted RAC membership.
• Discounted gym membership.
• 5 weeks annual leave (in hours) plus bank holidays.
• A supportive and friendly working environment focused on wellbeing and sustainability.

TT Electronics are committed to Equality, Diversity and Inclusion and actively encourage applications from under‑represented groups.

Please be aware that many roles at TT Electronics are subject to both security and export control restrictions, which may impose nationality limitations. All successful candidates must achieve the Baseline Personnel Security Standard (BPSS) after the offer stage. TT Electronics is unable to sponsor work visas for this role.

We hold Health and Safety in the highest regard at TT; any successful candidate will be required to pass a pre‑employment Drug and Alcohol Screening.