Hardware Engineer, Principal

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication, and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe, and Asia. MACOM is certified to the ISO
9001 international quality standard and ISO
14001 environmental management standard.

MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs, and InP fabrication, manufacturing, assembly, and test, and operational facilities throughout North America, Europe, and Asia. View our facilities at  In addition, MACOM offers foundry services that represent a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives, and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

• The Hardware Engineer, Principal designs, develops, and documents complex interconnect solutions for internal hardware needs as well as for customer hardware reference designs, identifies techniques and methodologies for modeling and measurement of devices and systems and actively participates in the evaluations of these. The interconnect solution may comprise multiple boards.
• The Hardware Engineer, Principal drives feasibility analyses at onset of PCB (printed circuit board) definition phase, evaluates and specifies electrical characteristics and performance of the PCB to determine compliance to appropriate regulating standards, and takes cradle-to-grave ownership of PCB according to requirements.
• Collects inputs from users of the PCB, including but not limited to, validation engineer, product engineer, IC design engineer, signal integrity engineer, etc.
• Draft a BRD (Board Required Document) / Block Diagram to clearly define what is expected of the board & review it.
• Consults with designers, application engineers for component selection and circuit around the device under test.
• Designs complex circuits as required.
• Captures schematic using EDA tool such as xDxDesigner.
• Creates electrical symbols and layout footprints for new components.
• Creates Bill of Material (BOM).
• Maintains CAD library.
• Creates layout of the board using EDA tools such as Siemens PADS.
• Interacts with external vendors as necessary.
• Performs Power Integrity of assigned boards using PI Analysis tools such as Hyper Lynx Power Integrity.
• Performs Signal Integrity simulations and analysis of assigned boards using tools such as Ansys SiWave or HFSS.
• Collaborates with PCB layout engineers to optimize routing for high-speed signals.
• Develops and validates models for transmission lines, connectors, vias, and IC packages.
• Conducts pre- and post-layout SI analysis to ensure compliance with design specifications.
• Supports design reviews and provides recommendations for signal integrity improvements.
• Works closely with cross-functional teams including electrical, mechanical, and firmware engineers.
• Performs lab measurements using oscilloscopes, VNAs, and TDRs to correlate with simulation results.
• Documents analysis results and presents findings to engineering leadership.
• Creates documentation for PCB fabrication and works with PCB vendors to resolve issues during manufacturing.
• Prepares Bonding Diagram for high-speed Optical interface and Chip on Board devices.
• Creates high-speed board design rules for automation and to speed up the Layout design time and effort.
• Organizes and drives board design reviews for assigned projects.
• Drives PCB verification and debug (board bring-up) covering both board functionality and performance.
• Provides mentorship to junior members of the team.

• PhD with 4 or more years of experience or MSEE with 6 or more years of experience or BSEE with 8 or more years of experience.
  6 or more years of experience/knowledge in schematic capture, PCB Design and layout using CAD tools such as xDxDesigner, PADS, Hyper Lynx, Siwave, and HFSS.
• Strong understanding of transmission line theory, impedance control, crosstalk, and jitter.
• Proficiency in SI simulation tools and lab equipment.
• Experience with high-speed interfaces such as PCIe, DDR, USB, Ethernet, etc.
• Experience with CAD Library creation/maintenance is a plus.
• Extensive knowledge on Board Design for manufacturing (DFM), PCB Fab Process.
• Extensive experience with lab equipment including VNAs, BERTs.
• Knowledge on firmware development and microcontrollers is a plus.
• Excellent problem-solving and communication skills.

The Salary Range for this position is $97,900 – $166,600. Actual salary offered to candidates will depend on several factors, including but not limited to, work location, relevant candidates’ experience, education, and specific knowledge, skills, and abilities.

EEO: MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not…