Internship Process and Material Analysis

Internship Process and Material Analysis

NXP Semiconductors, The Netherlands Ready to join the future of innovation in Product Diagnostic Center Nijmegen at NXP?

Become part of global laboratory organization, Product Diagnostic and Quality Center. Our team perform Failure Analysis and Material Analysis to deliver significant findings that add value by proactive, innovative and rapid resolution of NTI and NPI challenges and issues; enabling development of reliable technology and high quality products that support NXP business.

Your responsibilities

Learn and get familiar with the tool/technique

Design and Run an experiment

Create presentation and update progress of project in given format

Create working procedure document

Your team Product Diagnostic Center Nijmegen is well recognized as Best-in-class Digital & Analog Failure Analysis and Material Analysis support. Package Analysis team is providing package and board level failure analysis and provide circuit access and sample preparation support to enable in-die electrical failure analysis. We are working closely with business partners, Package/Front-End Innovation, Fabrication and Assembly and Test sites. We are a diversified team with high energy, an open collaboration environment and eagerness for continuous improvement.

Your profile

To be successful in this role you have:

Studying Material Sciences such as Analytical/Molecular/Physical Chemistry, or equivalent study at BSc, MSc level. The content and responsibilities of the internship will be adapted to the education level

Passionate in hands-on, lab-oriented environment

Detail oriented and drives for perfection with willingness to take ownership

Strong analytical problem solving

Effective oral and written communication and relation-skills with intercultural awareness

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