Principal Process Engineer - High Precision Machinery

Principal Process Engineer – Semiconductor Die Bonding Systems  We are looking for an experienced Process Engineer who thrives in an environment where micrometers matter and innovation drives every design choice. The role focuses on developing and optimizing the process steps of the ITEC Advance Semiconductor Die bonding systems to enable high-speed production (>70,000 units/hour) while maintaining high quality and yield in 24/7, 365‑day volume production.
Responsibilities   Involved from design & specification phase till actual implementation and testing phase.
Perform risk assessments and write test protocols.
Hands‑on testing the process capability of new/modified process in our lab in Nijmegen before releasing a process at the end customer.
Work closely with the quality department, Product Specialist and Service Engineers worldwide.
Collaborate with suppliers of process materials (wafers, adhesives) and customers in semiconductor back‑end and RFID label production.
Qualifications   Bachelor’s or master’s degree in applied physics or comparable field.
4+ years of experience in process engineering, preferably in semiconductor, high‑precision, robotics, or mechatronics domain.
Proactive mindset, strong communication skills, and ability to work effectively in multidisciplinary teams.
Structured, quality‑driven approach to process engineering challenges.
Willingness to travel incidentally for process release or advanced troubleshooting at customer sites.
Benefits  Next to a meaningful challenge and inspiring working environment, we believe great work should be rewarded.

Career development supports:
Career Ladder, Leadership Programs, Talent Program, Training.
Equal Opportunity Statement  ITEC is an Equal Opportunity/Affirmative Action Employer.

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