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Package Design Engineer - Signal and Power Integrity

Job in North Reading, Middlesex County, Massachusetts, 01864, USA
Listing for: Teradyne
Full Time position
Listed on 2026-10-07
Job specializations:
  • Engineering
    Electronics Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 111300 - 178200 USD Yearly USD 111300.00 178200.00 YEAR
Job Description & How to Apply Below
Package Design Engineer - Signal and Power Integrity (TERADYNE, North Reading, MA)

Location: North Reading, MA, US

We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!

We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive.

Our Purpose

TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to innovate and learn something new every day.

We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team – one that makes better decisions, drives innovation and delivers better business results.

Opportunity Overview

Teradyne is seeking a Package Design Engineer with an electrical engineering foundation and developing experience in signal integrity, power integrity, package design, or high-speed hardware development to support advanced measurement ASIC products within the Semiconductor Test Division.

This role contributes to the physical realization of complex RF, analog, digital, and mixed-signal ASIC products across the chip, package, board, socket, fixture, and system interconnect environment.

Working under limited direction and in collaboration with experienced package, SI/PI, thermal, mechanical, ASIC, PCB, manufacturing, and supplier teams, the Package Design Engineer will independently develop analysis approaches for assigned work, provide practical solutions to difficult package design problems, and contribute to design decisions whose accuracy can materially affect project cost and schedule.

  • Support ASIC package signal and power integrity development, including package stackup evaluation, bump and BGA escape planning, return-path control, power-delivery partitioning, and package-to-board co-design.
  • Develop and review package and PCB layout constraints for high-speed serial links, clocks, DUT I/O, power rails, and sensitive analog or mixed-signal interfaces while balancing electrical performance, manufacturability, reliability, cost, and schedule.
  • Apply electromagnetic and transmission-line principles to evaluate package, board, socket, connector, interposer, and fixture interconnects in the time and frequency domains.
  • Build, review, and document simulation models for insertion loss, return loss, crosstalk, mode conversion, skew, impedance discontinuities, resonances, eye behavior, and power-distribution performance.
  • Support package-level power-distribution-network analysis, including target impedance, decoupling strategy, DC IR drop, current density, transient droop or noise, and plane or cavity resonance.
  • Participate in thermal and mechanical co-design reviews addressing heat-flow paths, material and stackup choices, thermal-interface materials, package warpage and coplanarity, CTE interaction, stress, attachment methods, and package-to-board interfaces.
  • Collaborate with ASIC design, PCB design, thermal, mechanical, test, characterization, manufacturing, procurement, quality, EDA tool teams, and external package and PCB suppliers to identify and close assigned technical risks.
  • Contribute to design-for-manufacture and design-for-assembly reviews for package substrates and PCBs.
  • Plan and support simulation-to-hardware correlation using S-parameters, VNA, TDR/TDT, high-speed oscilloscopes, probes, fixtures, and coupon structures under guidance from senior engineers.
  • Prepare clear design-review materials, analysis summaries, requirements, constraints, model documentation, and action-item closure evidence.

All About You

We seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If you are ready to join us in this mission, take a closer look at the minimum criteria for the position.

  • Bachelor of…
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