Mechanical Engineer- Packaging

This role focuses on the mechanical and thermal design of precision assemblies for advanced imaging and sensor hardware, with a strong emphasis on mechanical packaging, electronic packaging, thermal‑mechanical design, sensor integration, and optomechanical systems. You will take ownership of hardware from concept through prototype, assembly, validation, and refinement, working hands‑on in a laboratory environment and collaborating closely with cross‑functional engineering teams.

• Design and develop precision mechanical packaging, electronic assemblies, and sensor integration hardware for advanced imaging and sensor systems.
• Perform mechanical tolerance and stack‑up analysis, including coefficient of thermal expansion (CTE) mismatch analysis across assemblies containing electronic, sensor, optical, and mechanical components.
• Evaluate materials and mechanical architectures to maintain alignment, reliability, and performance across varying temperature and environmental conditions.
• Perform or support thermal and structural analysis of mechanical and electronic assemblies to ensure robust performance.
• Define mechanical packaging and assembly approaches from device‑level integration through complete sensor and system‑level assemblies.
• Select and evaluate adhesives, epoxies, bonding methods, curing processes, and other assembly techniques suitable for precision hardware.
• Develop, refine, and improve assembly processes for precision mechanical and packaging applications.
• Design mechanical components, fixtures, housings, mounts, and interfaces using CAD tools.
• Build and evaluate prototypes, diagnose issues, and troubleshoot mechanical, thermal, alignment, and packaging problems.
• Collaborate closely with optics, electronics, test, manufacturing, and supplier teams to ensure integrated, manufacturable designs.
• Work with manufacturing partners and suppliers to assess component capabilities and assembly process feasibility.
• Create detailed engineering drawings, specifications, assembly documentation, test plans, and verification procedures.
• Drive and support the Engineering Change Order (ECO) process, including design revisions, change documentation, configuration control, and release management.
• Guide designs from concept through prototype, validation, and production readiness, ensuring smooth transition into manufacturing.
• Communicate technical findings, trade‑offs, and design decisions clearly to cross‑functional stakeholders and document outcomes thoroughly.

• Bachelors degree in Mechanical Engineering or a related engineering discipline.
• Hands‑on experience with precision mechanical assemblies, electronic packaging, sensor packaging, or related hardware development environments.
• Strong understanding of coefficient of thermal expansion (CTE), material compatibility, tolerance stack‑ups, and thermal‑mechanical behavior.
• Experience designing precision mechanical assemblies using CAD tools such as Solid Works.
• Experience performing thermal and/or structural analysis of mechanical assemblies.
• Understanding of manufacturing and assembly processes used for precision electronic, sensor, or mechanical hardware.
• Experience working with adhesives, epoxies, bonding, curing, and component attachment processes.
• Experience participating in engineering change management processes, including ECO/ECN documentation, design revisions, product release workflows, and configuration control.
• Hands‑on experience building, assembling, and troubleshooting prototype hardware.
• Ability to evaluate mechanical design trade‑offs involving alignment, thermal performance, materials, manufacturability, and reliability.
• Strong technical communication and documentation skills, both…