Mechanical Engineering, Principal

Overview

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO
9001 international quality standard and ISO
14001 environmental management standard. MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs, and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. MACOM offers foundry services that represents a key core competency within our business. MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors.

Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

Mechanical Engineering, Principal

Job Description:

Support new package design and development by working with a team of engineers and designers. Responsible for all mechanical aspects of new and legacy designs. Devices range from single chip packages to subsystem modules.

• Ownership of the compliance of designs to meet mechanical requirements
• Interaction with customers and ability to negotiate requirements where conflicts may occur
• Interaction with internal design engineers, project managers, assembly and test entities to ensure all aspects of the design are in line with expectations across the company
• Mechanical analyses including but not limited to structural, thermal and reliability
• Ownership and design of assembly and test fixtures
• Understanding of machining best practice and GD&T tolerancing
• Ability to work with vendors to understand their capabilities in aligning part designs with industry capabilities
• Understanding of various manufacturing techniques including subtractive metal fabrication, additive manufacturing, etching, laser cutting, welding and marking
• Ability to work in fast paced environment with small and large teams with little-to-no supervision

Mechanical Engineering Degree or similar with 8+ years of experience in an electronics packaging role. Experience with IC packaging, system and subsystem mechanical design and analysis. The ideal candidate will have experience with RF and millimeter wave types of products.

• Experience with packaging for RF-Power applications, using eutectic and/or sintered epoxy die attach
• Experience with aluminum, copper and other alloys for use in packaging and thermal transfer
• Understanding and awareness of coefficient of thermal expansion (CTE) matching between various mediums
• Understanding of metal plating standards and requirements
• Experience in reliability, failure analysis, and quality assurance in advanced package and process development
• Experience designing for manufacturing, both internally and externally, both piece-part and assemblies
• Knowledge of product characterization, testing, quality and reliability, including compliance testing and certification is a plus [MIL-PRF-38534, JEDEC, IPC, etc.]
• Intimate knowledge of structural analysis using 3D CAD tools as well as first principles
• Intimate knowledge of thermal analysis using 3D CAD tools as well as first principles
• Demonstrated ability to lead independent process development
• Ability to provide suppliers direction by working with design, assembly, and quality organizations
• Familiar with finite element analyses (FEA) and computational fluid dynamics (CFD) desired
• Familiar solving steady state and dynamic thermal problems
• Experience using:
  Solid Works, AutoCAD, and PCB layout viewers is ideal
• Strong problem solving skills along with good communication, teamwork, and interpersonal skills
• Experience in critical thinking and presentation skills
• Experience with supplier and program management roles
• Experience working in complex teams to understand and balance all aspects of a design to meet desired outcomes
• Ability to balance and prioritize multiple programs and needs simultaneously
• Fluent…