Field Applications Engineer; FAE) Intern - Summer

NXP Global Sales Introduction AI is rapidly moving beyond research labs and into the real world—powering advancements in vehicles, factories, hospitals, homes, and connected devices. NXP brings together secure edge intelligence, advanced semiconductor solutions, and deep system expertise to help customers build what’s next. Our Global Sales and Applications organization partners with customers to align technical solutions to application requirements, solve integration challenges, and accelerate design wins.

We are seeking a technically curious engineering student to join our Field Applications team and help enable the integration of NXP semiconductor technologies into real customer systems.

The NXP Americas Global Sales & Applications Summer Internship is a 12 week, paid program for rising juniors, seniors, and graduate students who combine a strong technical foundation with the drive and curiosity to work directly with customers. Interns are embedded in the Field Application Engineering organization, paired with an experienced FAE mentor, and assigned meaningful technical work from day one.

This internship is a primary pipeline into NXP’s Technical Sales & Applications Program (TSAP), our early-career pathway for full‑time technical sales and applications roles. Strong performers may receive a return offer upon graduation.

As a Field Applications Engineering Intern, you will work alongside experienced FAEs on customer‑facing technical projects with real business impact. You will help translate application requirements into practical NXP‑based solutions, support evaluations and proof‑of‑concepts, and develop hands‑on experience with embedded systems, lab validation, and design‑in activity. Sample responsibilities include:

• Work alongside FAEs to understand customer requirements and help select appropriate NXP MCUs, MPUs, connectivity, analog, power‑management, and edge‑processing solutions.
• Support technical customer meetings, design reviews, product evaluations, proof‑of‑concept activities, and NXP solution demonstrations.
• Help analyze customer issues, reproduce problems, document findings, and contribute to clear technical action plans and follow‑up.

• Bring up evaluation boards and reference designs; configure SDKs and development environments; and integrate example software into application prototypes.
• Develop or modify firmware and application code in C, C++, Python, or similar languages under the guidance of experienced engineers.
• Support embedded software debugging and system integration across real‑time control, sensor interfaces, connectivity, Linux, or RTOS‑based applications.

• Perform product evaluation, lab validation, and basic system‑level troubleshooting using oscilloscopes, logic analyzers, multimeters, power supplies, current/voltage probes, power analyzers, and software debug or trace tools.
• Assist with schematic and PCB reviews, interface checks, power‑up sequencing, signal observations, and hardware/software integration investigations.
• Create concise test plans, capture measurements, organize results, and communicate conclusions to technical and non‑technical stakeholders.

• Prepare customer‑ready technical presentations, demonstrations, quick‑start guides, application notes, and training material with guidance from senior engineers.
• Capture customer feedback and collaborate with sales, marketing, product management, product‑line, and engineering teams to improve tools, software, documentation, and support content.
• Present your summer project findings, technical approach, results, and recommendations to sales and…