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Photonics Packaging Engineer; Thailand​/Germany

Job in Germany, Pike County, Ohio, USA
Listing for: Aeva, Inc.
Full Time position
Listed on 2026-01-06
Job specializations:
  • Engineering
    Electronics Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
Position: Staff Photonics Packaging Engineer (Thailand/ Germany)
Location: Germany

About us:

Aeva’s mission is to bring the next wave of perception to a broad range of applications from automated driving to industrial robotics, consumer electronics, consumer health, security, and beyond. Aeva is transforming autonomy with its groundbreaking sensing and perception technology that integrates all key LiDAR components onto a silicon photonics chip in a compact module. Aeva 4D LiDAR sensors uniquely detect instant velocity in addition to 3D position, allowing autonomous devices like vehicles and robots to make more intelligent and safe decisions.

Role Overview

We are looking for a Photonics Integration Engineer with cross functional expertise in delivering photonics to various product lines.

What you'll do
  • Deliver photonics packaging solutions for various LiDAR & sensing product lines
  • Experience with laser integration on chip including design trade offs, process flows, test and reliability
  • Experience with multi-channel, multiwavelength laser integration including single and multi-emitter configuration and corresponding photonics requirements
  • Experience with photonics packaging with electronics with an emphasis on advanced packaging technologies such as flip chip integration, FOWLP and BGA packages.
  • Define characterization to assess impacts from packaging to photonic components
  • Drive characterization of photonics to solve system integration challenges
  • Drive validation through the product development cycle
What you have
  • 5+ years of experience with Photonics Packaging
  • 10 years’ experience with delivering integrated packages for photonics chipsets to product
  • Experience with 5 years or more of photonics packaging
  • Experience working cross functionally to resolve challenges during product integration
  • Strong presentation, communication skills and results orientation
  • Experience with working with cross functional teams to deliver cutting edge products
What's in it for you
  • Be part of a fast paced and dynamic team
  • Very competitive compensation and meaningful stock grants
  • Exceptional benefits:
    Medical, Dental, Vision, and more
  • Unlimited PTO:
    We care about results, not punching timecards
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