Senior Packaging & PCB Design Automation Engineer
Listed on 2026-10-06
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Engineering
Electronics Engineer, Automation & Mechatronics Engineer, Systems Engineer
Annapurna Labs seeks a Senior Design Automation Engineer to join our hardware team and contribute to the physical design of advanced IC packages and PCBs for next‑gen ML and data center ASICs. You will develop automation to enable physical design teams from floor planning through tape‑out and manufacturing release.
You will work with senior engineers and cross‑functional groups to optimize die RDL, interposer and PCB layouts, evaluate EDA tools, and implement scripting in Python, Skill and TCL
The Senior Packaging & PCB Design Automation Engineer position in the Engineering field is open for applications.
The advertised compensation is 185..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Senior Packaging & PCB Design Automation Engineer role in the description above.
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