Quantum Packaging Engineer - Die & Bonding
Listed on 2026-10-07
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Engineering
Packaging Engineer
Amazon Development Center U.S., Inc. in Pasadena, CA is seeking a Hardware Development Engineer with semiconductor process development experience in dicing, probing, wire bonding, and flip chip bonding to advance quantum computing hardware.
You will work in a cleanroom and in packaging to fabricate and test quantum processor chips, solving fabrication challenges and driving yield improvements. The role emphasizes hands-on packaging tasks, equipment operation, and collaboration across teams to
We would love to welcome a new Quantum Packaging Engineer
- Die & Bonding to our organisation in Omaha, NE, United States.
We would love to welcome a new Quantum Packaging Engineer
- Die & Bonding to our team in Omaha, NE, United States.
For the Quantum Packaging Engineer
- Die & Bonding position at Amazon Inc., we are reviewing applications now.
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