Distinguished R&D Microwave and Sensor Engineer - Integrated Circuit Designer, Remote

About Sandia

Sandia National Laboratories is the nation's premier science and engineering lab for national security and technology innovation, with teams of specialists focused on cutting‑edge work in a broad array of areas.

• Challenging work with amazing impact that contributes to security, peace, and freedom worldwide
• Extraordinary co‑workers
• Some of the best tools, equipment, and research facilities in the world
• Career advancement and enrichment opportunities
• Flexible work arrangements for many positions include 9/80 (work 80 hours every two weeks, with every other Friday off) and 4/10 (work 4 ten‑hour days each week) compressed workweeks, part‑time work, and telecommuting (a mix of onsite work and working from home)
• Generous vacation, strong medical and other benefits, competitive 401k, learning opportunities, relocation assistance and amenities aimed at creating a solid work/life balance*

* These benefits vary by job classification.

Are you looking for an opportunity to contribute to a highly motivated team focused on delivering qualified electronic components for a national security mission? The Advanced RF Integrated Circuits (ICs) and Microsystems Department (5255) is seeking an experienced IC designer who is knowledgeable in modern RF, analog, and digital design techniques, as well as IC fabrication, testing, qualification, and the delivery of custom‑designed systems on a chip.

The selected candidate will assume a leadership role within a team that interfaces with technology developers and application customers to improve system performance through new understanding and integration across a broad range of technologies, including subthreshold RF, analog and mixed‑signal components (semiconductor and piezoelectric) for radar, communication, IoT, solid‑state electronic devices, high‑speed interconnects and integration, and devices that exploit new nanoscale materials and physics.

• Lead IC designs within our internal radiation‑hardened technologies as well as modern external foundries
• Plans, conducts, and executes Sandia's science and engineering programs within the spectrum of fundamental research, development, or demonstration
• Play a key technical role in developing new ideas and proposals for research activities including junior staff
• Communicate results and findings to peers and sponsors through presentation, and peer‑reviewed publications
• Review/Write specifications for RF components used in radar systems
• Identify, develop, and pursue new technology opportunities in areas that support Sandia mission activities

The selected applicant can be a remote worker located in any U.S. State or District of Columbia. Regular or periodic travel to your assigned work location may be required.

$157,100 - $267,000

* Salary range is estimated, and actual salary will be determined after consideration of the selected candidate's experience and qualifications, and application of any approved geographic salary differential.

• Master's in Electrical Engineering plus eight years or more years' relevant experience
• RF or high‑speed integrated circuit design using Cadence Virtuoso
• Experience in radio frequency design including electromagnet modeling and analysis, frequency analysis, noise analysis, power matching analysis, radiation hardening by design and/or link budget analysis
• Ability to obtain and maintain a DOE Q‑level security clearance

• PhD in Electrical Engineering plus five (5) years' of relevant experience or proven experience designing LNA, mixer, power amplifiers, RF and analog filters, high speed analog, and PLL blocks
• Strong written and presentation skills to provide sponsors and vendors convincing evidence of quality designs
• Ability to work independently and within a multi‑disciplinary team of peers to meet specifications
• Strong interpersonal skills which include teamwork, effective leadership, negotiation, delegation, and conflict resolution
• Understanding of:
  • fabrication process for integrated circuits
  • die attaching, wire bonding, and packaging
  • advanced automated assembly processes for die and very small SMT components
• Experience:
  • developing…