IC Packaging engineer

Electronics | Hardware | FPGA Design Contracts

IC Resources is working with a client who is looking for a Senior Packaging Process Engineer, an expert in leading microelectronics assembly and validation, specialising in advanced packaging technologies. The Senior Packaging Process Engineer will work on advanced AI infrastructure, co‑packaged RF architectures, and photonic systems.

They would consider remote working but need to be open to coming onsite when required in Wales.

• Develop advanced packaging assembly processes including 2.5D and 3D integration
• Design and validate high‑speed interconnect solutions for system‑in‑package platforms
• Define interconnect schemes including flip chip, wafer‑level packaging and hybrid bonding
• Lead design‑for‑manufacturing activities with internal and external teams
• Run DOEs, reliability testing, failure analysis and process control
• Work with suppliers, partners and customers to evaluate materials and equipment
• Support lab‑based activities including process characterisation and prototyping
• Lead technical projects and contribute to proposals and funding activities
• Provide technical guidance across multidisciplinary engineering teams

• Strong experience in semiconductor packaging and microelectronics assembly
• Hands‑on experience with 2.5D/3D integration, hybrid bonding and SiP
• Knowledge of TSV, RDL and wafer‑level packaging processes
• Experience leading R&D or packaging development projects
• Understanding of electrical, thermal and system‑level integration challenges
• Familiarity with cleanroom environments and process control methods
• Strong problem‑solving and analytical capability
• Ability to work across multidisciplinary teams