ASIC STA Engineer

Artificial intelligence (AI) is transforming our world. It can perform cognitive functions that previously only humans could do, such as perceiving interactions across different modalities and environments - with the ability to quickly learn and then solve complex problems. Tensordyne is an AI system solution company that builds very high-performance, low-power generative AI inference systems. Our mission, through the creation of custom silicon, hardware and software, is to enable multimodal Generative AI inference acceleration at scale, with safe, sustainable, high-performance systems for our hyperscaler and neocloud data center customers.

We are at the leading edge of advancing the latest research and product improvements for generative Al inference solutions that will make Al even more advantageous for compelling new generative AI applications.

Tensordyne is a well funded, fast-paced startup company with headquarters in both Sunnyvale, CA, and Munich, Germany. We also have many talented team members working remotely across North America and Europe. We take care of our people and their families with comprehensive benefits, competitive compensation, flexible spending options, and associated programs, because building category-defining technology starts with a healthy, supported team.

Come join us as we shape the future of multimodal generative artificial intelligence!

In this leadership role, you will lead ASIC physical STA design and associated engineering workflow development for Tensordyne’s multimodal generative AI inference acceleration products. As a valued senior member of our ASIC team, you will guide and assist your colleagues to help improve frontend physical design with respect to STA both the block level and full-chip within a fast-paced, agile HPC development environment that utilizes GenAI frontier models, EDA tools from external companies like Cadence/Synopsys and as well as internally developed workflows.

You will drive Tensordyne’s optimization, implementation and timing exploration workflows (includes at a min. hierarchical STA, timing analysis, clock analysis) and technologies for the full ASIC chip STA flow. Your contributions will continuously innovate and improve scalable, reliable, high-performance systems and tools to enable the next generation of Tensordyne products. This is a hands-on role that’s ideal for ASIC physical design STA experts who have a multi-disciplinary engineering background, along with a keen interest in generative AI, and a passion for designing, debugging, optimizing and finding creative EDA solutions to complex technical challenges.

In this role, you will work very closely with your ASIC team members who are engaged in the design and verification of Tensordyne products, to understand and improve their workflows and EDA needs.

• 10+ years of hands-on ASIC engineering experience, that includes deep knowledge of VLSI/SoC chip physical design workflows, with EDA tools like Cadence/Synopsys Prime Time/Tempus, clock methodology, and development of hierarchical constraints.
• Strong physical design knowledge for STA analysis and ability to write SDCs for high-speed IP interfaces such as PCIe, Ser Des and other multi-clock domain blocks
• An Individual contributor tech lead, no direct reports initially, owning the full-chip timing closure and signoff flow
• Experience leading and supporting backend design team with understanding of STA timing issues, clock trees, routing and understanding of timing ECO generation for block level and full chip level.
• Understanding of Genus/Innovus tool usage with respect to STA.
• Excellent analytical, written, and verbal interpersonal skills along with an ability to productively collaborate…