Remote Package Design Engineer 5D/5D HPC
Phoenix, Maricopa County, Arizona, 85001, USA
Listed on 2026-10-27
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Engineering
Electronics Engineer, Electrical Engineering
SPD Technology is seeking a Package Design Engineer to join our Silicon Integration team. You will develop package substrate designs for 2.5D/3.5D packaging technologies used in high‑performance ML and AI chips, collaborating with SI/PI, thermal, mechanical, and PCB teams to optimize electrical performance and manufacturability.
The role covers routing feasibility, test vehicles, product-level designs, design reviews, and manufacturing documentation, with global, fully remote work and a focus on
Are you ready to take on the Remote Package Design Engineer – 2.5D/3.5D HPC role at SPD Technology?
Step into the Remote Package Design Engineer – 2.5D/3.5D HPC role at SPD Technology in United States and grow with us.
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