Remote Package Design Engineer, .5D/5D HPC Substrates
Houston, Harris County, Texas, 77001, USA
Listed on 2026-10-30
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Engineering
Electronics Engineer, Packaging Engineer
SPD Technology is seeking a Package Design Engineer to develop large form-factor package substrate designs for ML HPCs and to optimize the CAD flow for efficiency. You will coordinate with SI/PI, thermal, mechanical, and PCB teams to advance substrate architectures and enable reliable production.
The role emphasizes delivering design verification, DFM readiness, and production sign-off, while leveraging automation and scripting to boost productivity in a remote, global team environment.
We invite applications for the Remote Package Design Engineer, 2.5D/3.5D HPC Substrates position located in United States.
We appreciate your interest in this position.
Join Software Product Development Company and contribute to our ongoing work.
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This posting is for the Remote Package Design Engineer, 2.5D/3.5D HPC Substrates role at Software Product Development Company, based in United States.
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