Senior Process Engineer - Flip-Chip Packaging; Remote
-
Engineering
Process Engineer, Packaging Engineer, Manufacturing Engineer, Quality Engineering
Job Description & How to Apply Below
Lumicity partners with a leading semiconductor company to hire a Senior Process Engineer who will lead hands-on development of advanced packaging processes for flip-chip technology, from early development to qualification and high-volume manufacturing, with global team collaboration.
The role offers remote work in the USA, a base salary of $220,000–$270,000 plus performance bonus and RSUs, and full-time permanent employment, with opportunities to own critical process improvements in copper
The following role is for a Senior Process Engineer
- Flip-Chip Packaging (Remote) with Lumicity.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Senior Process Engineer
- Flip-Chip Packaging (Remote) role in the description above.
We appreciate your interest in this position.
Join Lumicity and contribute to our ongoing work.
Position Requirements
10+ Years work experience(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
View / Apply for Jobs
Matching My Jurisdiction