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Job Description & How to Apply Below
This position suits experienced engineers passionate about innovation and collaboration within R&D. You will tackle complex engineering tasks, design robust products, and engage with leading professionals in the imaging field. Your impact will be significant in creating systems used for various applications worldwide.
Key Responsibilities:
• Lead the design development of imaging sensors and PCBs
• Work closely with mechanical and software engineers on projects
• Document schematics and lead PCB layout supervision
• Conduct thorough analyses for reliability in designs
• Oversee all project phases from concept to release
Requirements:
•
B.Sc. in electrical or electronic engineering
• Minimum three years experience in PCB development
• Proficient in design for signal integrity
• Familiarity with communication protocols like SPI, I2C
• Experience mentoring junior engineers is advantageous
Contribute your skills to help shape the future of imaging technology with Teledyne.
Position Requirements
10+ Years
work experience
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