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Lead RF/EM Engineer Advanced Circuit Design
Job Description & How to Apply Below
As a Principal RF/EM Engineer, you will lead the design and development of cutting-edge ASIC packaging solutions. Collaborating with a multidisciplinary team, you will optimize and validate 3D electromagnetic models while conducting full-channel simulations. Your expertise will contribute to proof-of-concept integrations and the development of evaluation boards for next-gen high-speed products.
Key Responsibilities:
• Design advanced packaging solutions for high-speed ASIC devices
• Conduct electromagnetic modeling of transitions and signal paths
• Lead concept development to final design and verification
• Establish PCB design requirements, including signal integrity analysis
• Implement measurement fixtures for RF characterization
Requirements:
• M.Sc. or Ph.D. in Electrical Engineering, microwave specialization
• 5+ years in electromagnetic simulations using HFSS, ADS
• Experience with MATLAB or similar tools is a plus
• Proven design experience for passive structures above 50 GHz
• Strong knowledge of PCB fabrication technologies
Elevate RF engineering and develop the technologies shaping high-speed communications.
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