Principle RF​/EM Engineer

The Principal RF/EM Engineer will play a key leadership role in the design and development of advanced broadband RF circuits, ASIC packaging solutions, modules, and integrated systems. This role focuses on electromagnetic simulation, RF structure design, and validation of high-frequency interconnect technologies across multiple materials and substrate technologies.

The successful candidate will perform full-channel simulations and eye-diagram evaluations while collaborating with a multidisciplinary engineering team to create, optimize, and validate detailed 3D electromagnetic models. The position also involves proof-of-concept integration and evaluation board development supporting next-generation high-speed products.

• Design and develop packaging solutions for high-speed advanced ASIC devices, including substrate selection and comprehensive modeling of broadband passive structures such as PCBs, modules, and interconnect technologies.
• Perform detailed electromagnetic modeling of transitions and complete signal paths across ultra-broadband interconnect environments.
• Lead activities from early concept development through detailed design, including specification development, component definition, technology selection, fabrication requirement definition, tolerance evaluation, prototype development, and final verification.
• Establish PCB design requirements including stack-up configuration, routing strategies, via design, and tolerance requirements, and conduct post-layout signal integrity analysis.
• Design and implement measurement fixtures and calibration structures for high-speed RF characterization.
• Perform validation activities including broadband RF measurements up to 90 GHz using probe-station-based measurement setups.
• Enhance signal integrity methodologies and electromagnetic modeling approaches to improve agreement between simulation results and measured data.
• Produce technical documentation including test results, analysis reports, and engineering recommendations.

• M.Sc. or Ph.D. in Electrical Engineering with specialization in microwave engineering.
• Minimum five (5) years of experience performing electromagnetic simulations using HFSS and ADS.
• Experience with additional engineering tools such as MATLAB or similar analysis environments is desirable.
• Proven experience designing and characterizing passive structures operating above 50 GHz, including correlation of measured results to simulation models.
• Experience supporting telecommunications hardware development is highly desirable.
• Strong understanding of modeling parameters required for accurate electromagnetic simulation and variability analysis at microwave frequencies.
• Extensive RF measurement experience including use of vector network analyzers (VNAs), de-embedding techniques, AFR measurements, calibration methods, and RF probing techniques.
• Experience working with electro-optical systems and RF test instrumentation is considered an asset.
• Working knowledge of PCB fabrication technologies including HDBU and mSAP, along with fabrication and assembly design rules and mechanical integration considerations.
• Familiarity with alternative substrate technologies such as LTCC is beneficial.
• Strong written and verbal communication skills.
• Demonstrated ability to work effectively in team environments with strong organizational skills, attention to detail, and structured problem-solving capabilities.

Salary Range - $190,000 - $240,000