Mechanical Designer - Electronics Packaging

Position Overview

Highly motivated Mechanical Designer responsible for designing mechanical systems supporting electro‑mechanical products across multiple industries including Telecom, Industrial, Medical, Defense‑Aerospace, and Consumer.

• Develop, design and document mechanical assemblies and components including fabricated metal components, plastic injection molded components, and wire assemblies and cabling as needed.
• Develop solutions for electronics enclosures requiring thermal management, EMI/RF containment, interconnect, sealing, and ruggedization to meet customer environmental requirements.
• Develop solutions for printed circuit boards and assemblies (PCB/PCBA) for mechanical integrity, mounting, thermal management, EMI/RF containment, interconnect, grounding, etc.
• Develop, design and document manufacturing, manufacturing test, and assembly fixtures, and contribute to writing the manufacturing documentation for these fixtures' implementation.
• Investigate and solve problems related to mechanical functionality of components and assemblies.
• Write engineering change notices.
• Perform component research and recommendation.
• Assist with assessment of suppliers and supplied product conformance.

• Bachelor’s degree in Mechanical Engineering.
• 5–8 years of experience in mechanical design (Sheet Metal, Machined, Casting, Plastic Injection Molding).
• Excellent Mechanical CAD Design Tool skills (Solid Works, CREO or equivalent).
• Strong organizational, analytical and problem‑solving skills.
• Ability to quickly learn and apply new concepts, technologies, and solutions.
• Ability to interface with various disciplines/functional groups.
• Team player with strong verbal and written communication skills.
• Minimum 5–8 years of applicable work experience, preferably in electronics product development.

• Design experience within the Defence industry.
• Experience with MIL‑STD requirements and testing (MIL‑STD‑810H, MIL‑DTL‑901E, MIL‑STD‑461, etc).
• Ability to obtain and maintain CGP and/or Secret Clearance.
• Hands‑on experience with finite element analysis (FEA) for structural and vibration modeling (ANSYS/SW‑Sim, etc), and thermal/CFD modeling (SW‑Flow Sim/Flotherm, etc) with the ability to correlate simulation outputs to empirical test results.
• Background in DFM/DFA for high‑reliability assemblies, including collaboration with contract manufacturers to optimize tolerances, materials, and processes for defense‑grade production.

$90,000 – $130,000 per year.