Job Description & How to Apply Below
In this pivotal role, you will spearhead process architecture and development, aligning assembly strategies with critical performance parameters. With over eight years of hands-on experience in microelectronics packaging, you will lead the creation of sophisticated process recipes and become the technical anchor for the product solutions team.
Key Responsibilities:
• Define assembly strategies for optoelectronic modules
• Develop critical process recipes including Flip Chip and Wire Bonding
• Oversee capital equipment procurement and acceptance testing
• Provide DFx guidance to design teams and customers
• Manage engineering timelines and ensure timely NPI builds
Requirements:
• Master’s Degree in Engineering or related field
• Minimum 8 years’ experience in microelectronics
• Expertise in Flip Chip and Wire Bonding processes
• Strong knowledge of material interactions and soldering
• Proficiency in programming assembly equipment
Become a key contributor to innovative technologies at Sanmina's AMT division in Kanata.
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