Microelectronics Process Engineer at Sanmina

Elevate your career as a Microelectronics Process Engineer at Advanced Microsystems Technologies, a division of Sanmina in Kanata, ON.

Lead creative optical assembly strategies and handle advanced packaging processes. In this senior role, you will define assembly strategies for complex optoelectronic modules while ensuring alignment with thermal and throughput requirements.

Your hands‑on experience with flip‑chip and wire bonding processes will be crucial as you bridge the gap between R&D; and high‑volume manufacturing. You’ll also mentor junior engineers and manage engineering timelines for customer NPI builds.

• Define comprehensive assembly strategies aligned with device physics
• Lead advanced packaging development for critical process recipes
• Research and procure assembly equipment, overseeing acceptance testing
• Serve as the technical liaison for customer development phases
• Implement robust process controls and conduct rigorous troubleshooting

• Master’s Degree in Engineering or related field
• Minimum 8 years of process engineering experience
• Deep expertise in flip‑chip and wire bonding processes
• Strong understanding of material interactions and soldering processes
• Proficiency in automated assembly programming

Shape the future of microelectronics and impact technology advancements at Sanmina.