Microelectronic Packaging Design Engineer

Job Purpose

The Microelectronic Design Engineering team, part of Sanmina’s Global Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology, thermal, structural and reliability engineering.

• Select microelectronic technologies and definition of design concepts, based on product applications, requirements and specifications.
• Design microelectronic packages & modules, including integrating elements of material selections, substrate layout and designs, mechanical, thermal as well as incorporating key aspects of reliability, electrical (RF), optical, test and process engineering for volume manufacturing.
• Contribute to microelectronic design and engineering activities as part of a multidisciplinary product development team including electrical/RF engineering optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, in line with customer requirements and specifications.
• Generate product documentation including design specifications, drawings (piece parts, assembly, process) Bill of Materials, documentation release by engineering change order (ECO).
• Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components.
• Perform and support engineering product verification, ensuring compliance to product requirements.
• Support business development initiatives including interfacing with potential and existing customer, preparation of marketing materials, proposals and quotations.
• Support turnkey product development process through to manufacturing implementation.

• Bachelor’s Degree in Mechanical Engineering, Physics, Material Science, or other relevant degree with experience in electronic hardware design and packaging including multi‑chip modules and semiconductor packaging for RF/Microwave/Optical applications.
• Minimum of 2 years’ of relevant experience.
• Proficient with packaging and substrate design software (Cadence Allegro Package Designer Plus).
• Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
• Experience in end‑to‑end product development and manufacturing implementation.
• Familiar with commercial FEA tools and supporting analysis.
• Security clearance is an asset.
• Must be customer delivery focused, have strong communication skills, and be able to work well within a multidisciplinary product development team in a fast‑paced and challenging environment.

• The compensation range for this position is $70,000- $100,000 annually.
• This position is for an existing vacancy.
• The hiring process for this position does not use Artificial Intelligence (AI).

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.