Senior Design Engineer, Microelectronics and Advanced Packaging

Job Description

Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for the development of RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.

At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.

Come join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.

The Microelectronic Design Engineering team, as part of Sanmina’s Global Design Engineering Team, represents one of the key strategic growth areas. Our team provides engineering and design services in microelectronics, optical and semiconductor advanced packaging solutions supported through its in depth background in materials science, thermal/mechanical analysis, reliability engineering and advanced wafer level assembly and processing technologies.

We are seeking a Senior Design Engineer, Microelectronics and Advanced Packaging to join our team to support and lead both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.

• Technical Leadership:
  Act as the lead for microelectronic and advanced packaging solutions within a multidisciplinary team (RF, Optical, Reliability, and Process Engineering)
• Design and Engineering:
  Engineering of microelectronic packages and modules, integrating material selection, substrate layout, thermal/mechanical analysis, and DFM (Design for Manufacturing).
• Strategic Assessment:
  Evaluate industry trends to select microelectronic technologies and define design concepts that align with specific customer requirements and emerging market standards.
• Supplier & Lifecycle Management:
  Define specifications for custom outsourced components and manage the full documentation process, including BOMs, assembly drawings, and Engineering Change Orders (ECO).
• Mentorship:
  Provide technical oversight and guidance to junior members of the microelectronics design team.
• Communications:
  Interface directly with customers, management and project stakeholders on technical development updates, issues and status.
• Business Development:
  Support growth by interfacing with prospective customers, preparing technical proposals, and drafting quotations for novel engineering solutions.

• Education:
  
  Bachelor’s Degree in Mechanical Engineering, Physics, or a related technical discipline.
• Experience:
  
  Minimum of 12 years of relevant industry experience in electronic hardware design and semiconductor advanced packaging.
• Technical Expertise:
  Extensive background in microelectronic and advanced packaging technologies, materials, components, manufacturing methods. Proven track record in the technical leadership of end-to-end product development programs, from prototype to volume manufacturing.
• Software Proficiency: CAD:
  Expert-level skills in AutoCAD® and Solid Works®. Analysis:
  Experience with commercial FEA (Finite Element Analysis) tools. Substrate Design:
  Proficiency in Cadence® Allegro® Package Designer Plus e design software (Cadence® Allegro® Package Designer…