IC Packaging Design Intern: -Speed PCB & 3D Layout
Listed on 2026-10-01
-
Engineering
Electronics Engineer, Manufacturing Engineer, CAD/ AutoCAD/ Mechanical Design -
Design & Architecture
Manufacturing Engineer, CAD/ AutoCAD/ Mechanical Design
Semtech Canada is offering a 12–16 month IC packaging design internship in Ottawa, starting May 2027. The role involves designing IC chip carriers and supporting high-density, high-speed transmission layouts under the SIP group.
You will work with senior engineers, gain hands-on CAD design experience with Allegro/AutoCAD/Solid Works, and learn to apply signal integrity concepts in a collaborative team environment.
The IC Packaging Design Intern:
High-Speed PCB & 3D Layout position in the Engineering, Other field is open for applications.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the IC Packaging Design Intern:
High-Speed PCB & 3D Layout role at Sierra Wireless, based in Ottawa, ON, Canada.
We are looking to fill the IC Packaging Design Intern:
High-Speed PCB & 3D Layout position at Sierra Wireless in Ottawa, ON, Canada.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).