OUR STORY Tech Insights is the information Platform for the semiconductor industry.
Regarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, Tech Insights’ content informs decision makers and professionals whose success depends on accurate knowledge of the semiconductor industry—past, present, or future.
Over 650 companies and 150,000 users access the Tech Insights Platform, the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market analysis in the semiconductor industry.
This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary.
Tech Insights’ customers include the most successful technology companies who rely on Tech Insights’ analysis to make informed business, design, and product decisions faster and with greater confidence.
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WHY WORK WITH US Company-sponsored training and development opportunities Comprehensive benefits package (health, dental, vision, wellness, RRSP/401K Matching, annual fitness reimbursement) Flexible vacation policy Trusted device reimbursement program Community involvement opportunities through charitable alliances: Wellness resources and support I nclusive environment that prioritizes diversity, equity, and accessibility High-growth company driven by high performance Expected salary range: $175,000 - $195,000 CAD
THE OPPORTUNITY:
At Tech Insights, we decode technology to reveal the innovations shaping our world.
As the Technical Fellow, Advanced Packaging Integration, you’ll be a central figure in that mission, a recognized technical authority who bridges advanced packaging, processor architecture, and system-level performance.
This is a rare opportunity to shape the technical direction of two of Tech Insights’ most dynamic product areas:
Advanced Packaging and High Performance Computing.
You will bring deep expertise in advanced packaging and interconnect innovation, from hybrid bonding to co-packaged optics (CPO) and extend that insight up the stack to processors, networking silicon, and full system integration.
Your leadership will help define how Tech Insights connects device-level architecture to system-level performance, setting the foundation for next-generation compute analysis across the data center ecosystem.
Provide authoritative insights on leading-edge and emerging packaging and system integration technologies, including: 2.5D/3D integration, hybrid bonding, fan-out, glass core substrates, and embedded passives.
Co-packaged optics, chip-to-chip optical engines, and photonic-electronic IC integration (PIC + EIC).
Hybrid bonded chiplet stacks, SRAM chiplets, and next-generation thermal and power delivery innovations.
Own and Evolve Technology Roadmaps Shape and maintain Tech Insights’ Advanced Packaging and HPC technology roadmaps, aligning analysis coverage with industry trends and customer value.
Identify and prioritize parts and systems for analysis across processors, accelerators, and networking platforms to capture market-defining innovations.
Help drive product evolution toward system-level analysis, including server performance testing, interconnect and power delivery characterization, and thermal benchmarking.
Accelerate Content Creation through AI and Innovation Leverage AI-enabled tools and data workflows to increase the speed, accuracy, and scalability of analysis.
Create and…
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