OUR STORY
Tech Insights is the information Platform for the semiconductor industry.
Regarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, Tech Insights’ content informs decision makers and professionals whose success depends on accurate knowledge of the semiconductor industry—past, present, or future.
Over 650 companies and 150,000 users access the Tech Insights Platform, the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market intelligence in the semiconductor industry. This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary. Tech Insights’ customers include the most successful technology companies who rely on Tech Insights’ analysis to make informed business, design, and product decisions faster and with greater confidence.
For more information, visit
- Company-sponsored training and development opportunities
- Comprehensive benefits package (health, dental, vision, wellness, RRSP/401K Matching, annual fitness reimbursement)
- Flexible vacation policy
- Trusted device reimbursement program
- Community involvement opportunities through charitable alliances:
- Wellness resources and support
- Inclusive environment that prioritizes diversity, equity, and accessibility
- High-growth company driven by high performance
- Expected salary range: $160,000 - $170,000 CAD
As our Advanced Packaging Process Analyst, you’ll join our Technology team as a practiced analyst with in-depth understanding of state-of-the-art advanced packaging. You’ll participate in major campaigns and projects initiated by our client-facing team, analyzing devices manufactured with advanced semiconductor packaging process technology.
You’ll build process flows based on device structure, layout, and material analysis, measure critical dimensions from our reverse engineering results, and write the technical reports that inform our customers’ decisions. You’ll also help monitor emerging trends in heterogeneous integration.
WHAT YOU’LL DO- Build process flows for advanced packaging structures, including hybrid bonding, fan-out, 2.5D/3D integration, and interposer fabrication.
- Measure critical dimensions such as TSVs, bump pitch, interposer features, and substrate layers.
- Annotate images and write technical reports based on reverse engineering results.
- Review and compare analysis results generation over generation, and foundry/OSAT to foundry/OSAT.
- Write technical blogs and record video briefings on the state of the art in advanced packaging.
- Work closely with other analysts and support broader project teams on technology trends, process/materials analysis, and documentation.
- Answer customer questions on published reports.
- Bachelors or Masters degree in a relevant field (Physics, Electrical Engineering, Materials Science, or related).
- Strong knowledge of advanced packaging structures, materials, and integration schemes.
- 5+ years of industry experience in a foundry or OSAT in advanced packaging unit processes (hybrid bonding, TSV formation, fan-out, flip chip, interposer fabrication).
- Experience interpreting results from analytical methods such as SEM, TEM, EDS, EELS, and FIB.
- Knowledge of wafer probing and package final test processes and hardware will be considered an asset.
- Familiarity with silicon photonics and co-packaged optics (e.g., optical engine assembly, PIC+EIC integration, optical coupling) are considered an asset but not required.
- Strong analytical skills and the ability to work across multiple sources of information.
- Excellent…
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).