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Technical Officer, E-beam

Job in Ottawa, Ontario, Canada
Listing for: National Research Council of Canada
Full Time position
Listed on 2026-11-01
Job specializations:
  • Manufacturing / Production
    Production QC/QA
  • Engineering
Salary/Wage Range or Industry Benchmark: 60000 - 85000 CAD Yearly CAD 60000.00 85000.00 YEAR
Job Description & How to Apply Below

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Priority may be given to the following designated employment equity groups: women, Indigenous Peoples* (First Nations, Inuit and Métis), persons with disabilities and racialized persons*.

* The Employment Equity Act, which is under review, uses the terminology Aboriginal peoples and visible minorities.

Candidates are asked to self-declare when applying to this hiring process.

Organizational Unit:Canadian Photonics Fabrication Centre

Classification:TO-3

Duration: 1 Year

Work arrangements: Due to the nature of the work and operational requirements, this position will require full-time physical presence at the NRC work location identified.

* Note
:
The intent of this hiring process is to fill various term positions for the night and weekend shifts.

Discover the possible
The role

We are looking for Technical Officers to support the Canadian Photonics Fabrication Centre (CPFC) within NRC’s Emerging Technology and Photonics Research Centre portfolio. The Technical Officer is someone who shares the NRC core values of Integrity, Excellence, Respect, and Creativity.

The position will focus on providing process support for semiconductor prototype development and pre-commercial production in a class 100 – 1000 clean room facility environment.

The successful candidates will be involved in hands‑on wafer fabrication activities while maintaining high standards of quality to support client demands. These candidates would be members of a team of technical specialists responsible for the performance of a wide range of semiconductor wafer fabrication processes. Processes relevant to this position include, but are not limited to; electron‑beam (e‑beam) lithography, plasma dry‑etch, chemical wet‑etch, and metrology processing on indium phosphide (InP) substrates for relevant client projects, but other processing may be assigned as required by supervisors.

All processing must be accomplished in accordance with instructions contained in the manufacturing execution system (MES) and the schedule set by the operations and planning teams.

Applicants must demonstrate within the content of their application that they meet the following screening criteria in order to be given further consideration as candidates:

Education

Post‑secondary education in Electronic Engineering Technology, or Scientific discipline related to the position or an appropriate combination of education and work experience.

  • Extensive
    * hands‑on experience supporting III‑V wafer fabrication processes in a cleanroom environment.
  • Significant
    ** hands‑on experience operating complex manufacturing equipment used for wafer patterning and of semiconductor device fabrication, with priority given to those with experience in e‑beam lithography on III‑V Semiconductor materials.
  • Basic
    *** experience in the analyzing and interpreting process or metrology data.
  • Significant
    ** hands‑on experience in the safe handling and processing of chemicals in a cleanroom laboratory or semiconductor manufacturing environment.

* Extensive experience is defined as a minimum of six (6) years of experience.

** Significant experience is defined as two (2) to five (5) years.

*** Basic experience is defined as 6 months to 12 months.

Condition of employment
  • Reliability Status

For a Reliability Status, verification of background information over a period of 5 years is required.

  • Must be available to work night shift or weekend shift schedules;
  • Must qualify to work in a controlled Goods Zone, training will be provided; and
  • Must be able to work in a semiconductor cleanroom environment and wear required personal protective equipment (PPE).

Candidates will be assessed on the basis of the following criteria:

  • Ability to rigorously follow manufacturing procedures in a…
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