Lead, PCB Design - Signal Integrity - Stackup Specialist

L3

Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers’ mission and quest for professional growth. L3

Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do.

L3

Harris is the Trusted Disruptor in defense tech. With customers’ mission-critical needs always in mind, our employees deliver end-to-end technology solutions connecting the space, air, land, sea and cyber domains in the interest of national security.

Job Title:

Lead, PCB Design – Signal Integrity/Stackup Specialist

Job Code: 46234

Job Location:

Palm Bay, FL, Carlsbad, CA or Herndon, VA

Job Schedule:

9/80:
Employees work 9 out of every 14 days – totaling 80 hours worked, and have every other Friday off

L3

Harris has an immediate need for a Signal Integrity/Stackup PCB Design Specialist whose role defines and optimizes rigid, rigid-flex, and multilayer PCB stackups for signal integrity, power integrity, impedance control, EMI/EMC, thermal performance, and fabrication constraints.

You will work closely with electrical, RF, mechanical, layout, and manufacturing teams to translate CCA requirements into practical, production-ready signal integrity and board-layer strategies. This is a hands-on PCB design role with particular ownership of stackup definition, impedance planning, and stackup-related layout guidance. Team members will collaborate closely with electrical engineers, mechanical engineers, and manufacturing teams to ensure high-quality, reliable designs that meet performance and cost objectives.

• Design and document rigid, rigid-flex, and multilayer PCB stackups for high-speed, mixed-signal, RF, and power applications.
• Define controlled-impedance structures, dielectric materials, copper weights, layer assignments, and via strategies.
• Partner with electrical engineers to translate Signal Integrity(SI)/Power Integrity(PI) requirements into practical routing rules, return-path planning, reference-plane strategy, grounding, shielding, and layer-transition guidance.
• Evaluate stackup tradeoffs across electrical performance, EMI/EMC, thermal needs, mechanical requirements, cost, and manufacturability.
• Collaborate with PCB fabricators to validate materials, impedance coupons, fabrication tolerances, bend-region constraints, and production capability.
• Review PCB layouts and fabrication packages for stackup-related risks and provide clear corrective guidance.
• Maintain stackup drawings, impedance tables, fabrication notes, material specifications, and revision history.
• Support prototype and production issue resolution involving impedance, crosstalk, loss, resonance, warpage, or EMI.
• Developing rigid, rigid-flex, and multilayer PCB stackups for high-speed, RF, mixed-signal, or high-power products.
• Strong understanding of controlled impedance, transmission lines, return paths, dielectric properties, copper roughness, insertion loss, and crosstalk.
• Developing stackup requirements to PCB layout, including layer usage, differential-pair routing, via transitions, reference planes, and high-speed design constraints.
• Knowledge of rigid and rigid-flex PCB fabrication processes, materials, bend-region constraints, and manufacturer.
• Work directly with PCB fabricators and clearly communicating stackup, impedance, and material requirements.

• Bachelor’s Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree,…