Specialist, PCB Design

L3

Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers’ mission and quest for professional growth. L3

Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do.

L3

Harris is the Trusted Disruptor in defense tech. With customers’ mission-critical needs always in mind, our employees deliver end-to-end technology solutions connecting the space, air, land, sea and cyber domains in the interest of national security.

Job Title:
Specialist,
PCB Design

Job Code:
46230

Job Location:
Palm Bay, FL;
Carlsbad, CA;
Herndon,VA

Job Schedule: 9/80:
Employees work 9 out of every 14 days – totaling 80 hours worked, and have every other Friday off

L3

Harris has an immediate need fora PCB Designer role who will support the design and release of rigid, rigid-flex, and multilayer PCBs. The individual will work with electrical, RF, mechanical, and manufacturing teams, you will apply defined stackup, signal-integrity, and fabrication requirements to produce accurate, manufacturable PCB layouts.

Team members will collaborate closely with electrical engineers, mechanical engineers, and manufacturing teams to ensure high-quality, reliable designs that meet performance and cost objectives.

• Create printed circuit board layouts based on electrical engineering schematics and design requirements using industry-standard design tools.
• Develop and maintain detailed fabrication and assembly documentation, including drawings, stackups, and design notes.
• Perform design rule checks, manage constraints, and participate in design reviews in collaboration with engineering teams. Implement feedback to improve design robustness and reduce production risk.
• Coordinate with mechanical engineering teams to ensure proper integration of printed circuit boards within system enclosures and assemblies.
• Support component placement, routing strategies, and signal-integrity considerations for digital, power, analog, radio-frequency, and mixed-signal designs.
• Creating PCB layouts using Siemens Xpedition Layout.
• Interpreting electrical schematics and engineering documentation.
• Ability to understand fabrication drawings, assembly drawings, and relevant industry standards such as those produced by the Institute for Printed Circuits (IPC).

• Bachelor’s Degree and minimum 4 years of prior relevant experience. Graduate Degree and a minimum of 2 years of prior related experience. In lieu of a degree, minimum of 8 years of prior related experience.

• Siemens Engineering Data Management (EDM).
• Siemens Valor NPI experience.
• Siemens Blue Print PCB experience.
• Cadence Allegro PCB experience.
• Experience with high-speed digital design practices, including controlled-impedance routing and differential-pair layout.
• Experience designing multilayer printed circuit boards for radio-frequency or mixed-signal applications.
• Experience collaborating with contract manufacturers or fabrication vendors.
• Familiarity with Design for Manufacturability (DFM) and Design for Testability (DFT) principles.
• Experience with three-dimensional mechanical integration and electromagnetic-compatibility considerations.
• Familiarity with product lifecycle management (PLM) systems and engineering configuration-control processes.
• IPC Certified Interconnect Designer (CID/CID+).

In compliance with pay transparency requirements, the salary range for this role in California and in Virginia - Greater Washington, D.C. area…