Lead, PCB Design - Signal Integrity - Stackup Specialist

Position: Lead, PCB Design - Signal Integrity - Stackup Specialist (Various Locations)
Job Title:

Lead, PCB Design – Signal Integrity/Stackup Specialist Job Code: 46234

Job Location:

Palm Bay, FL, Carlsbad, CA or Herndon, VA

Job Schedule:

9/80:
Employees work 9 out of every 14 days – totaling 80 hours worked, and have every other Friday off

Job Description:

L3

Harris has an immediate need for a Signal Integrity/Stackup PCB Design Specialist whose role defines and optimizes rigid, rigid-flex, and multilayer PCB stackups for signal integrity, power integrity, impedance control, EMI/EMC, thermal performance, and fabrication constraints.

You will work closely with electrical, RF, mechanical, layout, and manufacturing teams to translate CCA  requirements into practical, production-ready signal integrity and board-layer strategies. This is a hands-on PCB design role with particular ownership of stackup definition, impedance planning, and stackup-related layout guidance.  Team members will collaborate closely with electrical engineers, mechanical engineers, and manufacturing teams to ensure high-quality, reliable designs that meet performance and cost objectives.

Essential Functions:

Design and document rigid, rigid-flex, and multilayer PCB stackups for high-speed, mixed-signal, RF, and power applications.

Define controlled-impedance structures, dielectric materials, copper weights, layer assignments, and via strategies.

Partner with electrical engineers to translate Signal Integrity(SI)/Power Integrity(PI) requirements into practical routing rules, return-path planning, reference-plane strategy, grounding, shielding, and layer-transition guidance.

Evaluate stackup tradeoffs across electrical performance, EMI/EMC, thermal needs, mechanical requirements, cost, and manufacturability.

Collaborate with PCB fabricators to validate materials, impedance coupons, fabrication tolerances, bend-region constraints, and production capability.

Review PCB layouts and fabrication packages for stackup-related risks and provide clear corrective guidance.

Maintain stackup drawings, impedance tables, fabrication notes, material specifications, and revision history.

Support prototype and production issue resolution involving impedance, crosstalk, loss, resonance, warpage, or EMI.Developing rigid, rigid-flex, and multilayer PCB stackups for high-speed, RF, mixed-signal, or high-power products.

Strong understanding of controlled impedance, transmission lines, return paths, dielectric properties, copper roughness, insertion loss, and crosstalk.

Developing stackup requirements to PCB layout, including layer usage, differential-pair routing, via transitions, reference planes, and high-speed design constraints.

Knowledge of rigid and rigid-flex PCB fabrication processes, materials, bend-region constraints, and manufacturer Work directly with PCB fabricators and clearly communicating stackup, impedance, and material requirements.

Required Qualifications:

Bachelor’s Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience.

Preferred Additional

Skills:

Proficiency with Siemens Xpedition PCB design or experience with similar tools.

Experience using Siemens Hyper Lynx Z-planner for PCB stackup design.

Experience with DDR, PCIe, USB, Ethernet, Ser Des, RF, or high-current power-delivery designs.

Cadence Allegro and Altium PCB experience.

Experience designing multilayer printed circuit boards for radio-frequency or mixed-signal applications.

Familiarity with Design for Manufacturability (DFM) and Design for Testability (DFT) principles.

Experience with three-dimensional mechanical integration and electromagnetic-compatibility considerations.

Familiarity with product lifecycle management (PLM) systems and engineering configuration-control processes.

IPC Certified Interconnect Designer (CID/CID+)In compliance with pay transparency requirements, the salary range for this role in California and in Virginia - Greater Washington, D.C. area is $110,500- $205,000 . This is not a guarantee of compensation or salary, as final offer amount may vary based on factors including but not limited to experience and geographic location. L3

Harris also offers a variety of benefits, including health and disability insurance, 401(k) match, flexible spending accounts, EAP, education assistance, parental leave, paid time off, and company-paid holidays. The specific programs and options available to an employee