Senior Photonic Packaging Engineer .5D/3D Interposers
Listed on 2026-10-13
-
Engineering
Packaging Engineer
CScale is building the interconnect for gigawatt-scale AI, focusing on integrated optical interconnect and high-speed packaging. The role centers on driving 2.5D/3D packaging development from concept to production and coordinating with OSATs and foundries to ensure reliability and manufacturability.
Ideal candidates will have hands-on experience with high-speed interposer-based packaging, cross-functional communication, and program management to meet tight schedules and complex integration
This posting is for the Senior Photonic Packaging Engineer for 2.5D/3D Interposers role at CScale, based in Palo Alto, CA, United States.
The advertised compensation is 180..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Senior Photonic Packaging Engineer for 2.5D/3D Interposers role in the description above.
We appreciate your interest in this position.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).