Senior Package Engineer — Multi-Die IC + Equity
Listed on 2026-10-17
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Engineering
Packaging Engineer
Delos Data is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for high-performance AI accelerators. You will lead package architecture, substrate design, manufacturability, and vendor engagement.
Responsibilities include selecting packaging types, defining stack-ups, and coordinating with design teams and foundries to ensure performance and reliability. The role supports bring-up and qualification across next-gen products.
The following position is for a Senior Package Engineer — Multi-Die IC Packages + Equity with Delos Data.
For the Senior Package Engineer — Multi-Die IC Packages + Equity position at Delos Data, we are reviewing applications now.
Step into the Senior Package Engineer — Multi-Die IC Packages + Equity role at Delos Data in Palo Alto, CA, United States and grow with us.
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