IC Package Design Engineer 5D/3D Packaging Expert
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Engineering
Job Description & How to Apply Below
Rivian Automotive is seeking an IC Package Design Engineer to lead physical layout, modeling, and analysis of advanced semiconductor packaging solutions for high-performance ICs. You will collaborate with IC Design, SI/PI, PCB Layout, Mechanical, Thermal, and Test teams, plus OSAT partners, to deliver robust packaging from concept to production.
Responsible for end-to-end layout, advanced packaging methods (FCBGA, SiP, 2.5D/3D), co-design with silicon and board teams, and ensuring DFM/DFT
The IC Package Design Engineer - 2.5D/3D Packaging Expert position in the Engineering field is open for applications.
This opportunity is part of our work in Engineering.
The advertised compensation is 186..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the IC Package Design Engineer - 2.5D/3D Packaging Expert role in the description above.
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