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Engineer III, Mechanical

Job in Parsippany-Troy Hills, Morris County, New Jersey, USA
Listing for: Marotta Controls
Full Time position
Listed on 2026-01-13
Job specializations:
  • Engineering
    Manufacturing Engineer, Mechanical Engineer, Electronics Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below

Position:

Engineer III, Mechanical (Electronics Packaging)

Location:

Parsippany, NJ

About Marotta Controls

Elevate your career at Marotta Controls, a New Jersey Top Workplace three years running! Dedicated to innovation, quality and excellence, we deliver cutting edge control systems for the Aerospace & Defense industry. At Marotta, we value bold thinking and teamwork, and we empower our employees to push boundaries while delivering top‑tier solutions to our customers. Our team fosters a fun, collaborative culture where creativity and technical excellence thrive!

Your next big opportunity starts here. Be part of a company where your work supports a mission that makes a difference — apply today!

Job Summary

The Electronics Packaging Mechanical Engineer is responsible for the physical design and construction of ruggedized electronics and electronics enclosures. The Engineer shall complete and/or contribute to the design, development, testing, qualification, and production support of products in a cost‑effective and timely fashion to meet the customer's needs and schedules. The engineer works within a multi‑disciplined organization and enlists the help of other disciplines when necessary.

Occasional light travel may be involved.

Essential Job Functions and Responsibilities
  • Design and development of ruggedized electronics and electronics enclosures from concept through all product life‑cycle phases.
  • Preliminary CAD design of electronics/enclosures.
  • Interface with electrical engineers to establish sizing of circuit card assemblies and material selection.
  • Coordinate creation of preliminary bill of material in the business system and verify its accuracy.
  • Perform or coordinate and review preliminary analytical results (hand calculations and/or FEA).
  • Communicate technical and schedule problems to Engineering Manager / Director, Contracts Administrator, and Program Manager in a timely manner.
  • Create, review, and approve processes for assembly, test, and related activities for development and qualification testing of a design.
  • Design cost‑effective, easily manufacturable hardware taking into account tolerance stack‑ups, ease of assembly, customer installation requirements, materials of construction, manufacturing methods, mechanical environment (thermal and vibration) and application loading.
  • Perform preliminary analytical results (hand calculations and FEA) and mistake‑proofing.
  • Create and modify drawings with appropriate GD&T, document change and effectiveness, and verify bill of material accuracy.
  • Disposition non‑conforming hardware and assist with correcting production/vendor issues.
  • Interface with internal and external customers to determine product changes needed for applications.
  • Write technical documents for internal and external customers.
  • Participate in design reviews (internal and external).
  • Lead failure investigations of designs as required.
  • Support new business pursuits that address program technical requirements and associated schedule and costs.
  • Mentor and guide junior team members.
Qualifications, Knowledge, and Skills Required
  • B.S. in Mechanical Engineering (advanced technical degree desirable).
  • 8+ years design experience and technical knowledge in mechanical engineering design of electronics packaging, preferably in aerospace or defense industry.
  • Ability to solve complex mechanical static & dynamic problems.
  • Precision, accuracy, and strong attention to detail.
  • High level of mechanical aptitude and knowledge.
  • Experience in 3D CAD solid modeling and understanding of mechanical design principles (experience with PTC CREO desirable).
  • Excellent verbal and written communication skills for interacting with all levels of personnel.
  • High computer literacy with MS Office/PC expertise and experience with applicable systems, programs, equipment.
  • Design experience with electronic packaging approaches for defense and aerospace applications, including design for high shock and vibration, challenging thermal conditions, innovative cooling techniques (e.g., phase‑change approaches).
  • Knowledge of IPC, WHMA, and NASA specifications for printed wiring boards (PWBs), circuit card assemblies (CCAs), wiring harnesses, and soldering.
  • Knowled…
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