Engineer III, Mechanical
Listed on 2026-01-13
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Engineering
Manufacturing Engineer, Mechanical Engineer, Electronics Engineer, Systems Engineer
Position:
Engineer III, Mechanical (Electronics Packaging)
Location:Parsippany, NJ
About Marotta ControlsElevate your career at Marotta Controls, a New Jersey Top Workplace three years running! Dedicated to innovation, quality and excellence, we deliver cutting edge control systems for the Aerospace & Defense industry. At Marotta, we value bold thinking and teamwork, and we empower our employees to push boundaries while delivering top‑tier solutions to our customers. Our team fosters a fun, collaborative culture where creativity and technical excellence thrive!
Your next big opportunity starts here. Be part of a company where your work supports a mission that makes a difference — apply today!
The Electronics Packaging Mechanical Engineer is responsible for the physical design and construction of ruggedized electronics and electronics enclosures. The Engineer shall complete and/or contribute to the design, development, testing, qualification, and production support of products in a cost‑effective and timely fashion to meet the customer's needs and schedules. The engineer works within a multi‑disciplined organization and enlists the help of other disciplines when necessary.
Occasional light travel may be involved.
- Design and development of ruggedized electronics and electronics enclosures from concept through all product life‑cycle phases.
- Preliminary CAD design of electronics/enclosures.
- Interface with electrical engineers to establish sizing of circuit card assemblies and material selection.
- Coordinate creation of preliminary bill of material in the business system and verify its accuracy.
- Perform or coordinate and review preliminary analytical results (hand calculations and/or FEA).
- Communicate technical and schedule problems to Engineering Manager / Director, Contracts Administrator, and Program Manager in a timely manner.
- Create, review, and approve processes for assembly, test, and related activities for development and qualification testing of a design.
- Design cost‑effective, easily manufacturable hardware taking into account tolerance stack‑ups, ease of assembly, customer installation requirements, materials of construction, manufacturing methods, mechanical environment (thermal and vibration) and application loading.
- Perform preliminary analytical results (hand calculations and FEA) and mistake‑proofing.
- Create and modify drawings with appropriate GD&T, document change and effectiveness, and verify bill of material accuracy.
- Disposition non‑conforming hardware and assist with correcting production/vendor issues.
- Interface with internal and external customers to determine product changes needed for applications.
- Write technical documents for internal and external customers.
- Participate in design reviews (internal and external).
- Lead failure investigations of designs as required.
- Support new business pursuits that address program technical requirements and associated schedule and costs.
- Mentor and guide junior team members.
- B.S. in Mechanical Engineering (advanced technical degree desirable).
- 8+ years design experience and technical knowledge in mechanical engineering design of electronics packaging, preferably in aerospace or defense industry.
- Ability to solve complex mechanical static & dynamic problems.
- Precision, accuracy, and strong attention to detail.
- High level of mechanical aptitude and knowledge.
- Experience in 3D CAD solid modeling and understanding of mechanical design principles (experience with PTC CREO desirable).
- Excellent verbal and written communication skills for interacting with all levels of personnel.
- High computer literacy with MS Office/PC expertise and experience with applicable systems, programs, equipment.
- Design experience with electronic packaging approaches for defense and aerospace applications, including design for high shock and vibration, challenging thermal conditions, innovative cooling techniques (e.g., phase‑change approaches).
- Knowledge of IPC, WHMA, and NASA specifications for printed wiring boards (PWBs), circuit card assemblies (CCAs), wiring harnesses, and soldering.
- Knowled…
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