Hardware Development Engineer, AWS CQC - Fabrication

Hardware Development Engineer, AWS CQC - Fabrication

Job  | Amazon Development Center U.S., Inc.

The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire a Hardware Development Engineer with experience in semiconductor process development – and in particular wire bonding, flip chip bonding, dicing – who will aid in AWS’s effort to bring cloud quantum computing services to its worldwide customer base. Through your work inside and outside of the cleanroom environment in the device fabrication group, you will solve problems related to the fabrication and characterization of novel quantum processors.

• Develop, improve and sustain fabrication and packaging processes.
• Analyze inline metrology and electrical test data.
• Interact with project leads to provide feedback that continuously improves the process.
• Maintain solid engineering principles and demonstrate superlative data analysis, problem solving, and communication skills.
• Perform and troubleshoot dicing, wire-bonding, flip chip bonding techniques and tools.
• Work effectively within a team environment.

The schedule is late afternoon through late night for this role, 5 pm‑2 am for example. Initial training will be performed during daylight hours. Once training is finished, the candidate is expected to work independently in the assigned hours.

The candidate will spend most of the time in a cleanroom environment, wearing a protective suit, performing hands‑on packaging tasks using IC packaging equipment, carrying out packaging steps for quantum computing product chips as well as for development projects.

Due to applicable export control laws and regulations, candidates must be either a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum, or be able to obtain a U.S. export license. If you are unsure if you meet these requirements, please apply and Amazon will review your application for eligibility.

The AWS Center for Quantum Computing recognizes that developing quantum computing is a long‑term endeavor, not a quick process. The team is dedicated to tackling the significant challenges involved in building a functional quantum computer. We are approaching this ambitious goal with enthusiasm and determination.

The fabrication/packaging team within AWS Center for Quantum Computing is responsible for delivering quantum computing product chips.

• Bachelor’s degree in mechanical engineering, electrical engineering, material science, physics, or equivalent.
• Expertise in two or more of the following processes and tools: flip chip bonding tools, wire bonding tools, saw dicing, stealth dicing, electrical probing on wafer/die.

• 4+ years of industry or academic research experience.
• Basic programming skills (e.g., Python, Julia, MATLAB).
• Experience conducting sophisticated analysis of complex data and translating the results into actionable deliverables, messages, and presentations.
• General working knowledge in one or more device fabrication areas: photo lithography, metal/dielectric/silicon etching, metal/dielectric thin film deposition.
• Knowledge or experience in superconducting microwave devices or superconducting qubits is a plus.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.